Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCV200-5FG256CXCV200-5FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
436
XCV200-5FG256IXCV200-5FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
217
XCV200-5FG456CXCV200-5FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
284
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
663
N/AXCV200-5PQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
166
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
1,186
N/AXCV200-5PQ240IAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
166
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
1,609
N/AXCV200-6BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
260
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
38
XCV200-6FG256CXCV200-6FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
692
XCV200-6FG456CXCV200-6FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
284
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
265
N/AXCV200-6PQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
166
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
988
N/AXCV2000E-6BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
607
N/AXCV2000E-6BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
802
N/AXCV2000E-6FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
2541952
Number of I/O:
804
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
392
N/AXCV2000E-6FG1156IAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
112
N/AXCV2000E-6FG680CAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
2541952
Number of I/O:
512
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
1,562
N/AXCV2000E-6FG680IAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
2541952
Number of I/O:
512
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
450
N/AXCV2000E-6FG860IAdvanced Micro DevicesIC FPGA 660 I/O 860FBGAFPGAs860-FBGA (42.5x42.5)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
2541952
Number of I/O:
660
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
950
N/AXCV2000E-7BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
214
N/AXCV2000E-7BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,236
N/AXCV2000E-7FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
508
N/AXCV2000E-7FG1156IAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
513

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