Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCV200E-8FG456CXCV200E-8FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
284
Number of Gates:
306393
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
64
XCV200E-8PQ240CXCV200E-8PQ240CAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
158
Number of Gates:
306393
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
366
N/AXCV2600E-6FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
3263755
Number of I/O:
804
Number of LABs/CLBs:
12696
Number of Logic Elements/Cells:
57132
Qualification:
N/A
Total RAM Bits:
753664
631
N/AXCV2600E-7FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
3263755
Number of I/O:
804
Number of LABs/CLBs:
12696
Number of Logic Elements/Cells:
57132
Qualification:
N/A
Total RAM Bits:
753664
1,447
N/AXCV2600E-8FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
3263755
Number of I/O:
804
Number of LABs/CLBs:
12696
Number of Logic Elements/Cells:
57132
Qualification:
N/A
Total RAM Bits:
753664
388
N/AXCV300-4BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
260
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
725
N/AXCV300-4BG352IAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
322970
Number of I/O:
260
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
528
N/AXCV300-4BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
341
XCV300-4BG432C4307XCV300-4BG432C4307Advanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
1,285
N/AXCV300-4BG432IAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
316
Number of Gates:
322970
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
1,492
XCV300-4FG456CXCV300-4FG456CAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
312
Number of Gates:
322970
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,295
XCV300-4FG456IXCV300-4FG456IAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
312
Number of Gates:
322970
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,570
N/AXCV300-4PQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
166
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
249
N/AXCV300-4PQ240IAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
322970
Number of I/O:
166
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
572
N/AXCV300-5BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
260
Number of Gates:
322970
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
624
N/AXCV300-5BG352IAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
260
Number of Gates:
322970
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
1,613
N/AXCV300-5BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
362
N/AXCV300-5BG432IAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
322970
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
41
XCV300-5FG456CXCV300-5FG456CAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
322970
Number of I/O:
312
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
1,432
XCV300-5FG456IXCV300-5FG456IAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
322970
Number of I/O:
312
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
1,586

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