Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCV300E-7FG256CXCV300E-7FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
176
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
524
XCV300E-7FG256IXCV300E-7FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
411955
Number of I/O:
176
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
131072
54
XCV300E-7FG456CXCV300E-7FG456CAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
312
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
206
XCV300E-7FG456C0773XCV300E-7FG456C0773Advanced Micro DevicesVIRTEX FPGA, 1536CLBSFPGAs456-FBGA (23x23)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
411955
Number of I/O:
312
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
131072
130
XCV300E-7FG456IXCV300E-7FG456IAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
312
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,622
N/AXCV300E-7PQ240CAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
411955
Number of I/O:
158
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
131072
950
N/AXCV300E-7PQ240IAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
411955
Number of I/O:
158
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
131072
1,102
N/AXCV300E-8BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
411955
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
131072
303
XCV300E-8FG256CXCV300E-8FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
176
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
1,417
XCV300E-8FG456CXCV300E-8FG456CAdvanced Micro DevicesIC FPGA 312 I/O 456FBGAFPGAs456-FBGA (23x23)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
312
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
680
N/AXCV300E-8PQ240CAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
158
Number of Gates:
411955
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
1,025
N/AN/AXCV3200E-6CG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156CBGAFPGAs1156-CBGA (35x35)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
16224
Number of Logic Elements/Cells:
73008
Total RAM Bits:
851968
Number of I/O:
804
Number of Gates:
4074387
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1156-BCBGA
Supplier Device Package:
1156-CBGA (35×35)
364
N/AN/AXCV3200E-7CG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156CBGAFPGAs1156-CBGA (35x35)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
16224
Number of Logic Elements/Cells:
73008
Total RAM Bits:
851968
Number of I/O:
804
Number of Gates:
4074387
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1156-BCBGA
Supplier Device Package:
1156-CBGA (35×35)
1,472
N/AXCV400-4BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
468252
Number of I/O:
316
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Qualification:
N/A
Total RAM Bits:
81920
939
N/AXCV400-4BG432IAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
468252
Number of I/O:
316
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Qualification:
N/A
Total RAM Bits:
81920
734
N/AXCV400-4BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
404
Number of Gates:
468252
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,743
N/AXCV400-4BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
468252
Number of I/O:
404
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Qualification:
N/A
Total RAM Bits:
81920
1,135
XCV400-4FG676CXCV400-4FG676CAdvanced Micro DevicesIC FPGA 404 I/O 676FCBGAFPGAs676-FBGA (27x27)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
404
Number of Gates:
468252
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
209
XCV400-4FG676IXCV400-4FG676IAdvanced Micro DevicesIC FPGA 404 I/O 676FCBGAFPGAs676-FBGA (27x27)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
404
Number of Gates:
468252
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
599
N/AXCV400-4HQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
468252
Number of I/O:
166
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Qualification:
N/A
Total RAM Bits:
81920
300

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