 | | XC3S400-5FG320C | Advanced Micro Devices | IC FPGA 221 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 320-FBGA (19×19) | 69 | |
 | | XC3S400-5FG456C | Advanced Micro Devices | IC FPGA 264 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 76 | |
 | | XC3S400-5FGG320C | Advanced Micro Devices | IC FPGA 221 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 320-FBGA (19×19) | 676 | |
 | | XC3S400-5FGG456C | Advanced Micro Devices | IC FPGA 264 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 896 | |
 | | XC3S400-5FT256C | Advanced Micro Devices | IC FPGA 173 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 641 | |
 | | XC3S400-5FTG256C | Advanced Micro Devices | IC FPGA 173 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,417 | |
 | | XC3S400-5PQ208C | Advanced Micro Devices | IC FPGA 141 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 168 | |
 | | XC3S400-5PQG208C | Advanced Micro Devices | IC FPGA 141 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 513 | |
 | | XC3S400-5TQG144C | Advanced Micro Devices | IC FPGA 97 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 952 | |
 | | XC3S4000-4FG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 613 | |
 | | XC3S4000-4FG676I | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 542 | |
 | | XC3S4000-4FG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 839 | |
 | | XC3S4000-4FG900I | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 900-FBGA (31×31) | 559 | |
 | | XC3S4000-4FGG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 589 | |
 | | XC3S4000-4FGG676I | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 62208 | 452 | |
 | | XC3S4000-4FGG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 198 | |
 | | XC3S4000-4FGG900I | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 62208 | 575 | |
 | | XC3S4000-5FG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 286 | |
 | | XC3S4000-5FGG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,081 | |
 | | XC3S4000-5FGG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 431 | |