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Total Products: 220,336
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
XC3S1600E-4FG320C
XC3S1600E-4FG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
250
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
187
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XC3S1600E-4FG320I
XC3S1600E-4FG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
250
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
1,732
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N/A
XC3S1600E-4FG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1600000
Number of I/O:
304
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
1,017
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QUOTE
XC3S1600E-4FG400I
XC3S1600E-4FG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
304
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
797
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QUOTE
XC3S1600E-4FG484C
XC3S1600E-4FG484CAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
376
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
271
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QUOTE
XC3S1600E-4FG484I
XC3S1600E-4FG484IAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1600000
Number of I/O:
376
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
1,708
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QUOTE
XC3S1600E-4FGG320C
XC3S1600E-4FGG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
250
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
139
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QUOTE
XC3S1600E-4FGG320I
XC3S1600E-4FGG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
250
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
217
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XC3S1600E-4FGG400C
XC3S1600E-4FGG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1600000
Number of I/O:
304
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
315
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QUOTE
XC3S1600E-4FGG400I
XC3S1600E-4FGG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
304
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
180
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QUOTE
XC3S1600E-4FGG484C
XC3S1600E-4FGG484CAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1600000
Number of I/O:
376
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
1,141
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QUOTE
XC3S1600E-4FGG484I
XC3S1600E-4FGG484IAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
376
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
644
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QUOTE
XC3S1600E-5FGG320C
XC3S1600E-5FGG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
250
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
215
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QUOTE
XC3S1600E-5FGG400C
XC3S1600E-5FGG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1600000
Number of I/O:
304
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
1,143
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QUOTE
XC3S1600E-5FGG484C
XC3S1600E-5FGG484CAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1600000
Number of I/O:
376
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
N/A
Total RAM Bits:
663552
738
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QUOTE
XC3S200-4FT256C
XC3S200-4FT256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Total RAM Bits:
221184
Number of I/O:
173
Number of Gates:
200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
626
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QUOTE
XC3S200-4FT256I
XC3S200-4FT256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
200000
Number of I/O:
173
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
N/A
Total RAM Bits:
221184
363
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QUOTE
XC3S200-4FTG256C
XC3S200-4FTG256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
200000
Number of I/O:
173
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
N/A
Total RAM Bits:
221184
304
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QUOTE
XC3S200-4FTG256I
XC3S200-4FTG256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Total RAM Bits:
221184
Number of I/O:
173
Number of Gates:
200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
383
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QUOTE
XC3S200-4PQ208C
XC3S200-4PQ208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Total RAM Bits:
221184
Number of I/O:
141
Number of Gates:
200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,192
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QUOTE

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