 | | XC3S1400A-4FGG484C | Advanced Micro Devices | IC FPGA 375 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 659 | |
 | | XC3S1400A-4FGG484I | Advanced Micro Devices | IC FPGA 375 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 25344 | 1,316 | |
 | | XC3S1400A-4FGG676C | Advanced Micro Devices | IC FPGA 502 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 305 | |
 | | XC3S1400A-4FGG676I | Advanced Micro Devices | IC FPGA 502 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 141 | |
 | | XC3S1400A-4FT256I | Advanced Micro Devices | IC FPGA 161 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 25344 | 253 | |
 | | XC3S1400A-4FTG256C | Advanced Micro Devices | IC FPGA 161 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 921 | |
 | | XC3S1400A-4FTG256I | Advanced Micro Devices | IC FPGA 161 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 931 | |
 | | XC3S1400A-5FGG484C | Advanced Micro Devices | IC FPGA 375 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 159 | |
 | | XC3S1400A-5FGG676C | Advanced Micro Devices | IC FPGA 502 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 802 | |
 | | XC3S1400A-5FTG256C | Advanced Micro Devices | IC FPGA 161 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 590 | |
 | | XC3S1400AN-4FG484C | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 1,664 | |
 | | XC3S1400AN-4FG484I | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 360 | |
 | | XC3S1400AN-4FG676C | Advanced Micro Devices | IC FPGA 502 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 1,544 | |
 | | XC3S1400AN-4FG676I | Advanced Micro Devices | IC FPGA 502 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 25344 | 369 | |
 | | XC3S1400AN-4FGG484C | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 48 | |
 | | XC3S1400AN-4FGG484I | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 1,898 | |
 | | XC3S1400AN-4FGG676C | Advanced Micro Devices | IC FPGA 502 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 904 | |
 | | XC3S1400AN-4FGG676I | Advanced Micro Devices | IC FPGA 502 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,330 | |
 | | XC3S1400AN-5FG484C | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 25344 | 1,176 | |
 | | XC3S1400AN-5FGG484C | Advanced Micro Devices | IC FPGA 372 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 25344 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 320 | |