 | | XCKU19P-L1FFVB2104I | Advanced Micro Devices | IC FPGA KINTEX UP LP 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 698 mV - 742 mV | -40°C – 100°C | Number of LABs/CLBs: 105300 Number of Logic Elements/Cells: 1842750 | 708 | |
 | | XCKU19P-L1FFVJ1760I | Advanced Micro Devices | IC FPGA KINTEX UP LP 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 698 mV - 742 mV | -40°C – 100°C | Number of LABs/CLBs: 105300 Number of Logic Elements/Cells: 1842750 | 1,124 | |
 | | XCKU19P-L2FFVB2104E | Advanced Micro Devices | IC FPGA KINTEX UP LP 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 698 mV - 742 mV | 0°C – 110°C | Number of LABs/CLBs: 105300 Number of Logic Elements/Cells: 1842750 | 807 | |
 | | XCKU19P-L2FFVJ1760E | Advanced Micro Devices | IC FPGA KINTEX UP LP 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 105300 Number of Logic Elements/Cells: 1842750 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5×42.5) | 388 | |
 | N/A | XCKU3P-1FFVA676E | Advanced Micro Devices | IC FPGA 256 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 976 | |
 | | XCKU3P-1FFVB676E | Advanced Micro Devices | IC FPGA 280 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 106 | |
 | | XCKU3P-1FFVB676I | Advanced Micro Devices | IC FPGA 280 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 654 | |
 | N/A | XCKU3P-1FFVD900E | Advanced Micro Devices | IC FPGA 304 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 171 | |
 | N/A | XCKU3P-1FFVD900I | Advanced Micro Devices | IC FPGA 304 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 1,101 | |
 | | XCKU3P-1SFVB784E | Advanced Micro Devices | IC FPGA 304 I/O 784FCBGA | FPGAs | 784-FCBGA (23x23) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23×23) | 366 | |
 | N/A | XCKU3P-1SFVB784I | Advanced Micro Devices | IC FPGA 256 I/O 784FCBGA | FPGAs | 784-FCBGA (23x23) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 1,245 | |
 | | XCKU3P-2FFVA676E | Advanced Micro Devices | IC FPGA 256 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 620 | |
 | N/A | XCKU3P-2FFVA676I | Advanced Micro Devices | IC FPGA 256 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 1,021 | |
 | | XCKU3P-2FFVB676E | Advanced Micro Devices | IC FPGA 280 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 616 | |
 | | XCKU3P-2FFVB676I | Advanced Micro Devices | IC FPGA 280 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 161 | |
 | N/A | XCKU3P-2FFVD900E | Advanced Micro Devices | IC FPGA 304 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 | 467 | |
 | | XCKU3P-2FFVD900I | Advanced Micro Devices | IC FPGA 304 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31×31) | 18 | |
 | | XCKU3P-2SFVB784E | Advanced Micro Devices | IC FPGA 304 I/O 784FCBGA | FPGAs | 784-FCBGA (23x23) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23×23) | 161 | |
 | | XCKU3P-2SFVB784I | Advanced Micro Devices | IC FPGA 304 I/O 784FCBGA | FPGAs | 784-FCBGA (23x23) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23×23) | 1,220 | |
 | | XCKU3P-3FFVA676E | Advanced Micro Devices | IC FPGA 256 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.873V ~ 0.927V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Voltage – Supply: 0.873V ~ 0.927V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 297 | |