 | | 5SGSMD3E1H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 482 | |
 | N/A | 5SGSMD3E1H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 705 | |
 | N/A | 5SGSMD3E2H29C1G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 743 | |
 | | 5SGSMD3E2H29C1N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 772 | |
 | N/A | 5SGSMD3E2H29C1WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 46 | |
 | | 5SGSMD3E2H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 1,331 | |
 | | 5SGSMD3E2H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 630 | |
 | | 5SGSMD3E2H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 456 | |
 | | 5SGSMD3E2H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 508 | |
 | | 5SGSMD3E2H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 791 | |
 | | 5SGSMD3E2H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 435 | |
 | | 5SGSMD3E2H29C3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 1,761 | |
 | | 5SGSMD3E2H29C3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,092 | |
 | N/A | 5SGSMD3E2H29C3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 972 | |
 | | 5SGSMD3E2H29I2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 33 | |
 | | 5SGSMD3E2H29I2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,216 | |
 | | 5SGSMD3E2H29I2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 1,668 | |
 | | 5SGSMD3E2H29I2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 511 | |
 | | 5SGSMD3E2H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,183 | |
 | | 5SGSMD3E2H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 981 | |