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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | 5SGSMD3E2H29I3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 497 | |
 | 5SGSMD3E2H29I3L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 546 | ||
 | N/A | 5SGSMD3E2H29I3LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 877 | |
 | 5SGSMD3E2H29I3LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,386 | ||
 | 5SGSMD3E2H29I3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,466 | ||
 | N/A | 5SGSMD3E2H29I3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 10 | |
 | 5SGSMD3E3H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,192 | ||
 | 5SGSMD3E3H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 244 | ||
 | 5SGSMD3E3H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 550 | ||
 | 5SGSMD3E3H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 713 | ||
 | 5SGSMD3E3H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 618 | ||
 | N/A | 5SGSMD3E3H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 352 | |
 | 5SGSMD3E3H29C3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 965 | ||
 | 5SGSMD3E3H29C3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,606 | ||
 | N/A | 5SGSMD3E3H29C3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,129 | |
 | 5SGSMD3E3H29C4G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 88 | ||
 | 5SGSMD3E3H29C4N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 584 | ||
 | 5SGSMD3E3H29C4WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 357 | ||
 | N/A | 5SGSMD3E3H29I3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 450 | |
 | 5SGSMD3E3H29I3L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 243 |
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