 | | 5SGXMA3E3H29C4G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 474 | |
 | | 5SGXMA3E3H29C4N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 472 | |
 | | 5SGXMA3E3H29C4WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 1,431 | |
 | N/A | 5SGXMA3E3H29I3G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,623 | |
 | | 5SGXMA3E3H29I3L | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 1,536 | |
 | | 5SGXMA3E3H29I3LG | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 81 | |
 | | 5SGXMA3E3H29I3LN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 1,348 | |
 | | 5SGXMA3E3H29I3N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 280 | |
 | | 5SGXMA3E3H29I3WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 310 | |
 | N/A | 5SGXMA3E3H29I4G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 182 | |
 | | 5SGXMA3E3H29I4N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 458 | |
 | | 5SGXMA3E3H29I4WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 268 | |
 | | 5SGXMA3H1F35C1G | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 102 | |
 | | 5SGXMA3H1F35C1N | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 922 | |
 | N/A | 5SGXMA3H1F35C1WN | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,326 | |
 | N/A | 5SGXMA3H1F35C2G | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,303 | |
 | | 5SGXMA3H1F35C2LG | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 1,537 | |
 | | 5SGXMA3H1F35C2LN | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 200 | |
 | | 5SGXMA3H1F35C2N | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 292 | |
 | N/A | 5SGXMA3H1F35C2WN | Intel | IC FPGA 600 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 788 | |