Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2A70B724C7
EP2A70B724C7AlteraIC FPGA 540 I/O 724BGAFPGAs724-BGA (35x35)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Total RAM Bits:
1146880
Number of I/O:
540
Number of Gates:
5250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
724-BBGA, FCBGA
Supplier Device Package:
724-BGA (35×35)
754
EP2A70B724C8
EP2A70B724C8AlteraIC FPGA 540 I/O 724BGAFPGAs724-BGA (35x35)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Total RAM Bits:
1146880
Number of I/O:
540
Number of Gates:
5250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
724-BBGA, FCBGA
Supplier Device Package:
724-BGA (35×35)
164
EP2A70B724C9EP2A70B724C9AlteraIC FPGA 540 I/O 724BGAFPGAs724-BGA (35x35)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5250000
Number of I/O:
540
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Qualification:
N/A
Total RAM Bits:
1146880
1,442
EP2A70F1508C7
EP2A70F1508C7AlteraIC FPGA 1060 I/O 1508FBGAFPGAs1508-FBGA (40x40)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Total RAM Bits:
1146880
Number of I/O:
1060
Number of Gates:
5250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1508-BBGA, FCBGA
Supplier Device Package:
1508-FBGA (40×40)
523
EP2A70F1508C8EP2A70F1508C8AlteraIC FPGA 1060 I/O 1508FBGAFPGAs1508-FBGA (40x40)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5250000
Number of I/O:
1060
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Qualification:
N/A
Total RAM Bits:
1146880
1,507
EP2A70F1508C9
EP2A70F1508C9AlteraIC FPGA 1060 I/O 1508FBGAFPGAs1508-FBGA (40x40)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
6720
Number of Logic Elements/Cells:
67200
Total RAM Bits:
1146880
Number of I/O:
1060
Number of Gates:
5250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1508-BBGA, FCBGA
Supplier Device Package:
1508-FBGA (40×40)
641
EP2AGX125DF25C4EP2AGX125DF25C4IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
1,276
N/AN/AEP2AGX125DF25C4GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
1,075
EP2AGX125DF25C4N
EP2AGX125DF25C4NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
610
EP2AGX125DF25C5EP2AGX125DF25C5IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
1,548
N/AN/AEP2AGX125DF25C5GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
796
EP2AGX125DF25C5NEP2AGX125DF25C5NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
1,968
EP2AGX125DF25C6
EP2AGX125DF25C6IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
1,395
N/AN/AEP2AGX125DF25C6GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
1,486
EP2AGX125DF25C6NEP2AGX125DF25C6NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
836
EP2AGX125DF25I3
EP2AGX125DF25I3IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
186
N/AN/AEP2AGX125DF25I3GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
830
EP2AGX125DF25I3NEP2AGX125DF25I3NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
557
EP2AGX125DF25I5
EP2AGX125DF25I5IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Total RAM Bits:
8315904
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
204
N/AN/AEP2AGX125DF25I5GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
4964
Number of Logic Elements/Cells:
118143
Qualification:
N/A
Total RAM Bits:
8315904
1,654

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