 | | EP2AGX45CU17C5 | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 1,478 | |
| N/A | N/A | EP2AGX45CU17C5G | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 828 | |
 | | EP2AGX45CU17C5N | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 1,511 | |
 | | EP2AGX45CU17C6 | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 147 | |
 | | EP2AGX45CU17C6G | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 1,507 | |
 | | EP2AGX45CU17C6N | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 1,005 | |
| N/A | N/A | EP2AGX45CU17I3 | Intel | IC FPGA 1805 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 42959 Number of Logic Elements/Cells: 42959 | 1,357 | |
 | | EP2AGX45CU17I3G | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 479 | |
 | | EP2AGX45CU17I3N | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | -40°C – 100°C | Number of Logic Elements/Cells: 42959 | 708 | |
 | | EP2AGX45CU17I5 | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | -40°C – 100°C | Number of Logic Elements/Cells: 42959 | 239 | |
| N/A | N/A | EP2AGX45CU17I5G | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 553 | |
 | | EP2AGX45CU17I5N | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 565 | |
 | | EP2AGX45DF25C4 | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 520 | |
| N/A | N/A | EP2AGX45DF25C4G | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 1,589 | |
 | | EP2AGX45DF25C4N | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 1,210 | |
 | | EP2AGX45DF25C5 | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 118 | |
 | | EP2AGX45DF25C5G | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 182 | |
 | | EP2AGX45DF25C5N | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 1,446 | |
 | | EP2AGX45DF25C6 | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 779 | |
 | | EP2AGX45DF25C6G | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 561 | |