 | N/A | EP2AGX260FF35C4G | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 783 | |
 | | EP2AGX260FF35C4N | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 1,259 | |
 | | EP2AGX260FF35C5 | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 186 | |
 | N/A | EP2AGX260FF35C5G | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 57 | |
 | | EP2AGX260FF35C5N | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 406 | |
 | | EP2AGX260FF35C6 | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 1,041 | |
 | N/A | EP2AGX260FF35C6G | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 1,116 | |
 | | EP2AGX260FF35C6N | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 636 | |
 | | EP2AGX260FF35C6NES | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,268 | |
 | | EP2AGX260FF35I3 | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,694 | |
 | N/A | EP2AGX260FF35I3G | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 545 | |
 | | EP2AGX260FF35I3N | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 986 | |
 | N/A | EP2AGX260FF35I3NAB | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,219 | |
 | N/A | EP2AGX260FF35I3NGA | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,487 | |
 | | EP2AGX260FF35I5 | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 124 | |
 | | EP2AGX260FF35I5G | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 191 | |
 | | EP2AGX260FF35I5N | Intel | IC FPGA 612 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 | 1,814 | |
 | | EP2AGX45CU17C4 | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 729 | |
| N/A | N/A | EP2AGX45CU17C4G | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 1,751 | |
 | | EP2AGX45CU17C4N | Intel | IC FPGA 156 I/O 358UBGA | FPGAs | 358-UBGA, FCBGA (17x17) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FCBGA (17×17) | 186 | |