Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2AGX260FF35C4GN/AEP2AGX260FF35C4GIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
783
EP2AGX260FF35C4NEP2AGX260FF35C4NIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
1,259
EP2AGX260FF35C5
EP2AGX260FF35C5IntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
186
EP2AGX260FF35C5GN/AEP2AGX260FF35C5GIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
57
EP2AGX260FF35C5NEP2AGX260FF35C5NIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
406
EP2AGX260FF35C6EP2AGX260FF35C6IntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
1,041
EP2AGX260FF35C6GN/AEP2AGX260FF35C6GIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
1,116
EP2AGX260FF35C6NEP2AGX260FF35C6NIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
636
EP2AGX260FF35C6NES
EP2AGX260FF35C6NESIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
1,268
EP2AGX260FF35I3
EP2AGX260FF35I3IntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
1,694
EP2AGX260FF35I3GN/AEP2AGX260FF35I3GIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
545
EP2AGX260FF35I3N
EP2AGX260FF35I3NIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
986
EP2AGX260FF35I3NABN/AEP2AGX260FF35I3NABIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
1,219
EP2AGX260FF35I3NGAN/AEP2AGX260FF35I3NGAIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
1,487
EP2AGX260FF35I5
EP2AGX260FF35I5IntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Total RAM Bits:
12038144
Number of I/O:
612
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
124
EP2AGX260FF35I5GEP2AGX260FF35I5GIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
191
EP2AGX260FF35I5NEP2AGX260FF35I5NIntelIC FPGA 612 I/O 1152FBGAFPGAs1152-FBGA (35x35)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
612
Number of LABs/CLBs:
10260
Number of Logic Elements/Cells:
244188
Qualification:
N/A
Total RAM Bits:
12038144
1,814
EP2AGX45CU17C4EP2AGX45CU17C4IntelIC FPGA 156 I/O 358UBGAFPGAs358-UBGA, FCBGA (17x17)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
156
Number of LABs/CLBs:
1805
Number of Logic Elements/Cells:
42959
Qualification:
N/A
Total RAM Bits:
3517440
729
N/AN/AEP2AGX45CU17C4GIntelIC FPGA 156 I/O 358UBGAFPGAs358-UBGA, FCBGA (17x17)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1805
Number of Logic Elements/Cells:
42959
Total RAM Bits:
3517440
Number of I/O:
156
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
358-LFBGA, FCBGA
Supplier Device Package:
358-UBGA, FCBGA (17×17)
1,751
EP2AGX45CU17C4N
EP2AGX45CU17C4NIntelIC FPGA 156 I/O 358UBGAFPGAs358-UBGA, FCBGA (17x17)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1805
Number of Logic Elements/Cells:
42959
Total RAM Bits:
3517440
Number of I/O:
156
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
358-LFBGA, FCBGA
Supplier Device Package:
358-UBGA, FCBGA (17×17)
186

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