 | | EP2AGX45DF25C6N | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 1,123 | |
| N/A | N/A | EP2AGX45DF25C6NGA | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 462 | |
 | | EP2AGX45DF25I3 | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 870 mV - 930 mV | -40°C – 100°C | Number of Logic Elements/Cells: 42959 | 1,079 | |
| N/A | N/A | EP2AGX45DF25I3G | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 949 | |
 | | EP2AGX45DF25I3N | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 608 | |
 | | EP2AGX45DF25I5 | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 947 | |
| N/A | N/A | EP2AGX45DF25I5G | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 1,431 | |
 | | EP2AGX45DF25I5N | Intel | IC FPGA 252 I/O 572FBGA | FPGAs | 572-FBGA, FC (25x25) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25×25) | 1,130 | |
 | | EP2AGX45DF29C4 | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 707 | |
 | N/A | EP2AGX45DF29C4G | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 978 | |
 | | EP2AGX45DF29C4N | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 634 | |
 | | EP2AGX45DF29C5 | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 767 | |
 | N/A | EP2AGX45DF29C5G | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 1,452 | |
 | | EP2AGX45DF29C5N | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 969 | |
 | | EP2AGX45DF29C6 | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 820 | |
 | | EP2AGX45DF29C6G | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 808 | |
 | | EP2AGX45DF29C6N | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 42959 | 930 | |
 | | EP2AGX45DF29I3 | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | -40°C – 100°C | Number of Logic Elements/Cells: 42959 | 235 | |
 | N/A | EP2AGX45DF29I3G | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 56 | |
 | | EP2AGX45DF29I3N | Intel | IC FPGA 364 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 42959 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 831 | |