Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2AGX65DF29C5N
EP2AGX65DF29C5NIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
701
EP2AGX65DF29C6EP2AGX65DF29C6IntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
364
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Qualification:
N/A
Total RAM Bits:
5371904
846
EP2AGX65DF29C6GEP2AGX65DF29C6GIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
364
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Qualification:
N/A
Total RAM Bits:
5371904
566
EP2AGX65DF29C6N
EP2AGX65DF29C6NIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
368
EP2AGX65DF29I3GN/AEP2AGX65DF29I3GIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,355
EP2AGX65DF29I3N
EP2AGX65DF29I3NIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,610
EP2AGX65DF29I3NAAN/AEP2AGX65DF29I3NAAIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
336
EP2AGX65DF29I5
EP2AGX65DF29I5IntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,020
EP2AGX65DF29I5G
EP2AGX65DF29I5GIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
364
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,757
EP2AGX65DF29I5NEP2AGX65DF29I5NIntelIC FPGA 364 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
364
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Qualification:
N/A
Total RAM Bits:
5371904
733
N/AN/AEP2AGX65DM17I6GIntelIC FPGA 156 I/OFPGAsN/A870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
156
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Qualification:
N/A
Total RAM Bits:
5371904
1,398
N/AN/AEP2AGX65DM17I6NIntelIC FPGA 156 I/OFPGAs-0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
156
Voltage – Supply:
0.87V ~ 0.93V
Operating Temperature:
-40°C ~ 100°C (TJ)
154
N/AN/AEP2AGX65DM17I6NAAIntelIC FPGA 156 I/OFPGAs-0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
60214
Total RAM Bits:
5371904
Number of I/O:
156
Voltage – Supply:
0.87V ~ 0.93V
Operating Temperature:
-40°C ~ 100°C (TJ)
456
EP2AGX95DF25C4EP2AGX95DF25C4IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
2530
Number of Logic Elements/Cells:
89178
Qualification:
N/A
Total RAM Bits:
6839296
144
N/AN/AEP2AGX95DF25C4GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Total RAM Bits:
6839296
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
307
EP2AGX95DF25C4NEP2AGX95DF25C4NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Qualification:
N/A
Total RAM Bits:
6839296
44
EP2AGX95DF25C5
EP2AGX95DF25C5IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Total RAM Bits:
6839296
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
101
N/AN/AEP2AGX95DF25C5GIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Total RAM Bits:
6839296
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
345
EP2AGX95DF25C5NEP2AGX95DF25C5NIntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)870 mV - 930 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
260
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Qualification:
N/A
Total RAM Bits:
6839296
1,004
EP2AGX95DF25C6
EP2AGX95DF25C6IntelIC FPGA 260 I/O 572FBGAFPGAs572-FBGA, FC (25x25)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3747
Number of Logic Elements/Cells:
89178
Total RAM Bits:
6839296
Number of I/O:
260
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
572-BGA, FCBGA
Supplier Device Package:
572-FBGA, FC (25×25)
750

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