Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2C35U484C6NEP2C35U484C6NIntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
322
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Qualification:
N/A
Total RAM Bits:
483840
301
EP2C35U484C7
EP2C35U484C7IntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Total RAM Bits:
483840
Number of I/O:
322
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
1,362
EP2C35U484C7N
EP2C35U484C7NIntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Total RAM Bits:
483840
Number of I/O:
322
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
592
EP2C35U484C8
EP2C35U484C8IntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Total RAM Bits:
483840
Number of I/O:
322
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
1,199
EP2C35U484C8NEP2C35U484C8NIntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
322
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Qualification:
N/A
Total RAM Bits:
483840
370
EP2C35U484I8EP2C35U484I8IntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
322
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Qualification:
N/A
Total RAM Bits:
483840
675
EP2C35U484I8N
EP2C35U484I8NIntelIC FPGA 322 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2076
Number of Logic Elements/Cells:
33216
Total RAM Bits:
483840
Number of I/O:
322
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
1,655
EP2C50F484C6
EP2C50F484C6IntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
294
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
934
EP2C50F484C6N
EP2C50F484C6NIntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
294
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
66
EP2C50F484C7EP2C50F484C7IntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
294
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Qualification:
N/A
Total RAM Bits:
594432
731
EP2C50F484C7NEP2C50F484C7NIntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
294
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Qualification:
N/A
Total RAM Bits:
594432
1,556
EP2C50F484C8
EP2C50F484C8IntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
294
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
525
EP2C50F484C8NEP2C50F484C8NIntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
294
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Qualification:
N/A
Total RAM Bits:
594432
599
EP2C50F484I8
EP2C50F484I8IntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
294
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
783
EP2C50F484I8N
EP2C50F484I8NIntelIC FPGA 294 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
294
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
458
EP2C50F672C6
EP2C50F672C6IntelIC FPGA 450 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
450
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
25
EP2C50F672C6N
EP2C50F672C6NIntelIC FPGA 450 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
450
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
1,188
EP2C50F672C7
EP2C50F672C7IntelIC FPGA 450 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
450
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
667
EP2C50F672C7N
EP2C50F672C7NIntelIC FPGA 450 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
450
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
494
EP2C50F672C8
EP2C50F672C8IntelIC FPGA 450 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3158
Number of Logic Elements/Cells:
50528
Total RAM Bits:
594432
Number of I/O:
450
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
1,466

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