 | | EP4SE820H35I3N | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 1,709 | |
 | | EP4SE820H35I4 | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 938 | |
 | | EP4SE820H35I4G | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 46 | |
 | | EP4SE820H35I4N | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 137 | |
 | | EP4SE820H40C3 | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 532 | |
 | | EP4SE820H40C3G | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 91 | |
 | | EP4SE820H40C3N | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5×42.5) | 1,409 | |
 | | EP4SE820H40C4 | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5×42.5) | 36 | |
 | | EP4SE820H40C4G | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 895 | |
 | | EP4SE820H40C4N | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 130 | |
 | | EP4SE820H40I3 | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5×42.5) | 635 | |
 | | EP4SE820H40I3G | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (45x45) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 104 | |
 | | EP4SE820H40I3N | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 23 | |
 | | EP4SE820H40I4 | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,637 | |
 | | EP4SE820H40I4N | Intel | IC FPGA 976 I/O 1517HBGA | FPGAs | 1517-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,920 | |
 | | EP4SGX110DF29C2X | Intel | IC FPGA 372 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 105600 | 460 | |
 | N/A | EP4SGX110DF29C2XG | Intel | IC FPGA 372 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 105600 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 910 | |
 | | EP4SGX110DF29C2XN | Intel | IC FPGA 372 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 105600 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 876 | |
 | | EP4SGX110DF29C3 | Intel | IC FPGA 372 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 105600 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 684 | |
 | | EP4SGX110DF29C3G | Intel | IC FPGA 372 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | 0°C – 85°C | Number of Logic Elements/Cells: 105600 | 585 | |