 | | EP4SE820F43C3 | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,957 | |
 | | EP4SE820F43C3G | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 3 | |
 | | EP4SE820F43C3N | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 552 | |
 | | EP4SE820F43C4 | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5×42.5) | 782 | |
 | | EP4SE820F43C4G | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,383 | |
 | | EP4SE820F43C4N | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,528 | |
 | | EP4SE820F43I3 | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5×42.5) | 179 | |
 | | EP4SE820F43I3G | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,421 | |
 | | EP4SE820F43I3N | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5×42.5) | 482 | |
 | | EP4SE820F43I4 | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5×42.5) | 885 | |
 | | EP4SE820F43I4G | Intel | IC FPGA 1120 I/O 1760FBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 335 | |
 | | EP4SE820F43I4N | Intel | IC FPGA 1120 I/O 1760FCBGA | FPGAs | 1760-FCBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 215 | |
 | | EP4SE820H35C3 | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 773 | |
 | | EP4SE820H35C3G | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 167 | |
 | | EP4SE820H35C3N | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 1,145 | |
 | | EP4SE820H35C4 | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 268 | |
 | | EP4SE820H35C4G | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 948 | |
 | | EP4SE820H35C4N | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 1,055 | |
 | | EP4SE820H35I3 | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 1,857 | |
 | | EP4SE820H35I3G | Intel | IC FPGA 744 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 | 810 | |