 | N/A | 5SGXMA3E2H29I2G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 220 | |
 | | 5SGXMA3E2H29I2L | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 1,083 | |
 | N/A | 5SGXMA3E2H29I2LG | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 707 | |
 | | 5SGXMA3E2H29I2LN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 942 | |
 | | 5SGXMA3E2H29I2N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 835 | |
 | N/A | 5SGXMA3E2H29I2WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 422 | |
 | N/A | 5SGXMA3E2H29I3G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 112 | |
 | | 5SGXMA3E2H29I3L | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 10 | |
 | N/A | 5SGXMA3E2H29I3LG | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 45 | |
 | | 5SGXMA3E2H29I3LN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 845 | |
 | | 5SGXMA3E2H29I3N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,288 | |
 | N/A | 5SGXMA3E2H29I3WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,062 | |
 | | 5SGXMA3E3H29C2G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 57 | |
 | | 5SGXMA3E3H29C2L | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 393 | |
 | | 5SGXMA3E3H29C2LG | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 787 | |
 | | 5SGXMA3E3H29C2LN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 284 | |
 | | 5SGXMA3E3H29C2N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 395 | |
 | | 5SGXMA3E3H29C2WN | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 859 | |
 | | 5SGXMA3E3H29C3G | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 | 618 | |
 | | 5SGXMA3E3H29C3N | Intel | IC FPGA 600 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 157 | |