Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
A3P600-1FGG144A3P600-1FGG144Microchip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
97
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LBGA
Supplier Device Package:
144-FPBGA (13×13)
1,443
A3P600-1FGG144IN/AA3P600-1FGG144IMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
97
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,028
A3P600-1FGG256A3P600-1FGG256Microchip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
177
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
1,277
A3P600-1FGG256IA3P600-1FGG256IMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
177
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
522
A3P600-1FGG484A3P600-1FGG484Microchip TechnologyIC FPGA 235 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
235
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
135
A3P600-1FGG484IN/AA3P600-1FGG484IMicrochip TechnologyIC FPGA 235 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
235
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
424
A3P600-1PQ208N/AA3P600-1PQ208Microchip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
154
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,190
A3P600-1PQ208IN/AA3P600-1PQ208IMicrochip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
154
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,779
A3P600-1PQG208A3P600-1PQG208Microchip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
154
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
694
A3P600-1PQG208IN/AA3P600-1PQG208IMicrochip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
154
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,373
A3P600-2FG144A3P600-2FG144Microchip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
97
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LBGA
Supplier Device Package:
144-FPBGA (13×13)
1,709
A3P600-2FG144IN/AA3P600-2FG144IMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
97
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,840
A3P600-2FG256A3P600-2FG256Microchip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
177
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
526
A3P600-2FG256IN/AA3P600-2FG256IMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
177
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
523
A3P600-2FG484A3P600-2FG484Microchip TechnologyIC FPGA 235 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
235
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
687
A3P600-2FG484IA3P600-2FG484IMicrochip TechnologyIC FPGA 235 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
235
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
511
A3P600-2FGG144N/AA3P600-2FGG144Microchip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
97
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,209
A3P600-2FGG144IN/AA3P600-2FGG144IMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
97
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
242
A3P600-2FGG256A3P600-2FGG256Microchip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
110592
Number of I/O:
177
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
1,063
A3P600-2FGG256IA3P600-2FGG256IMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
177
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
573

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