 | | 10M08DCF484I7G | Intel | IC FPGA 250 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | -40°C – 100°C | Number of Logic Elements/Cells: 8000 | 597 | |
 | | 10M08DCU324A7G | Intel | IC FPGA 246 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15V ~ 1.25V | -40°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Supplier Device Package: 324-UBGA (15×15) | 1,550 | |
 | | 10M08DCU324C8G | Intel | IC FPGA 246 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 324-UBGA (15×15) | 996 | |
 | | 10M08DCU324I7G | Intel | IC FPGA 246 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15 V - 1.25 V | -40°C – 100°C | Number of Logic Elements/Cells: 8000 | 872 | |
 | | 10M08DCV81C7G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 81-UFBGA, WLCSP Supplier Device Package: 81-VBGA, WLCSP (4.5×4.4) | 302 | |
 | | 10M08DCV81C8G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15 V - 1.25 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 756 | |
 | | 10M08DCV81I7G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15 V - 1.25 V | -40°C – 100°C | Number of Logic Elements/Cells: 8000 | 1,074 | |
 | | 10M08DFF484C7G | Intel | IC FPGA 250 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 920 | |
 | | 10M08DFV81C7G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15 V - 1.25 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 282 | |
 | | 10M08DFV81C8G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 81-UFBGA, WLCSP Supplier Device Package: 81-VBGA, WLCSP (4.5×4.4) | 1,354 | |
 | | 10M08DFV81C8GES | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15 V - 1.25 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 138 | |
 | | 10M08DFV81I7G | Intel | IC FPGA 56 I/O 81WLCSP | FPGAs | 81-VBGA, WLCSP (4.5x4.4) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 81-UFBGA, WLCSP Supplier Device Package: 81-VBGA, WLCSP (4.5×4.4) | 1,881 | |
 | | 10M08SAE144C8G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20×20) | 138 | |
 | | 10M08SAE144I7G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20×20) | 1,714 | |
 | | 10M08SAE144I7P | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 8000 | 7 | |
 | | 10M08SAM153C8G | Intel | IC FPGA 112 I/O 153MBGA | FPGAs | 153-MBGA (8x8) | 2.85 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 1,200 | |
 | | 10M08SAM153I7G | Intel | IC FPGA 112 I/O 153MBGA | FPGAs | 153-MBGA (8x8) | 2.85V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 153-MBGA (8×8) | 224 | |
 | | 10M08SAU169A7G | Intel | IC FPGA 130 I/O 169UBGA | FPGAs | 169-UBGA (11x11) | 2.85V ~ 3.465V | -40°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Supplier Device Package: 169-UBGA (11×11) | 1,024 | |
 | | 10M08SAU169C8G | Intel | IC FPGA 130 I/O 169UBGA | FPGAs | 169-UBGA (11x11) | 2.85 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 8000 | 295 | |
 | | 10M08SAU169I7G | Intel | IC FPGA 130 I/O 169UBGA | FPGAs | 169-UBGA (11x11) | 2.85V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 169-UBGA (11×11) | 507 | |