Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC6VLX550T-2FFG1759CXC6VLX550T-2FFG1759CAdvanced Micro DevicesIC FPGA 840 I/O 1759FCBGAFPGAs1759-FCBGA (42.5x42.5)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
42960
Number of Logic Elements/Cells:
549888
Total RAM Bits:
23298048
Number of I/O:
840
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1759-BBGA, FCBGA
Supplier Device Package:
1759-FCBGA (42.5×42.5)
378
XC6VLX75T-1FF484IXC6VLX75T-1FF484IAdvanced Micro DevicesIC FPGA 240 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
336
XC6VLX75T-1FF784CXC6VLX75T-1FF784CAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
784-BBGA, FCBGA
Supplier Device Package:
784-FCBGA (29×29)
644
XC6VLX75T-1FFG484CXC6VLX75T-1FFG484CAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
830
XC6VLX75T-1FFG484IXC6VLX75T-1FFG484IAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,436
XC6VLX75T-1FFG784CXC6VLX75T-1FFG784CAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
784-BBGA, FCBGA
Supplier Device Package:
784-FCBGA (29×29)
393
XC6VLX75T-1FFG784IXC6VLX75T-1FFG784IAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
1,305
XC6VLX75T-2FF484CXC6VLX75T-2FF484CAdvanced Micro DevicesIC FPGA 240 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
944
XC6VLX75T-2FF484IXC6VLX75T-2FF484IAdvanced Micro DevicesIC FPGA 240 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
106
XC6VLX75T-2FFG484CXC6VLX75T-2FFG484CAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
306
XC6VLX75T-2FFG484IXC6VLX75T-2FFG484IAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
582
XC6VLX75T-2FFG784CXC6VLX75T-2FFG784CAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
1,429
XC6VLX75T-2FFG784IXC6VLX75T-2FFG784IAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
188
XC6VLX75T-2FFV484I4243N/AXC6VLX75T-2FFV484I4243Advanced Micro DevicesIC FPGA 240 I/O 484FCBGAFPGAs484-FCBGA (23x23)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
98
XC6VLX75T-3FF484CXC6VLX75T-3FF484CAdvanced Micro DevicesIC FPGA 240 I/O 484FCBGAFPGAs484-FCBGA (23x23)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
116
XC6VLX75T-3FFG484CXC6VLX75T-3FFG484CAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
1,784
XC6VLX75T-3FFG784CXC6VLX75T-3FFG784CAdvanced Micro DevicesIC FPGA 360 I/O 784FCBGAFPGAs784-FCBGA (29x29)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Qualification:
N/A
Total RAM Bits:
5750784
1,411
XC6VLX75T-L1FFG484CXC6VLX75T-L1FFG484CAdvanced Micro DevicesIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)0.87V ~ 0.93V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
289
XC6VSX315T-1FF1156IXC6VSX315T-1FF1156IAdvanced Micro DevicesIC FPGA 600 I/O 1156FCBGAFPGAs1156-FCBGA (35x35)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
600
Number of LABs/CLBs:
24600
Number of Logic Elements/Cells:
314880
Qualification:
N/A
Total RAM Bits:
25952256
1,517
XC6VSX315T-1FF1759IXC6VSX315T-1FF1759IAdvanced Micro DevicesIC FPGA 720 I/O 1759FCBGAFPGAs1759-FCBGA (42.5x42.5)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
24600
Number of Logic Elements/Cells:
314880
Total RAM Bits:
25952256
Number of I/O:
720
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1759-BBGA, FCBGA
Supplier Device Package:
1759-FCBGA (42.5×42.5)
814

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