Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC7S75-1FGGA676QXC7S75-1FGGA676QAdvanced Micro DevicesIC FPGA 400 I/O 676FBGAFPGAs676-FPBGA (27x27)0.95V ~ 1.05V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
400
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FPBGA (27×27)
235
XC7S75-2FGGA484CXC7S75-2FGGA484CAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
338
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
511
XC7S75-2FGGA484IXC7S75-2FGGA484IAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
338
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,416
XC7S75-2FGGA676CXC7S75-2FGGA676CAdvanced Micro DevicesIC FPGA 400 I/O 676FPBGAFPGAs676-FPBGA (27x27)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
400
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Qualification:
N/A
Total RAM Bits:
4331520
55
XC7S75-2FGGA676IXC7S75-2FGGA676IAdvanced Micro DevicesIC FPGA 400 I/O 676FPBGAFPGAs676-FPBGA (27x27)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
400
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FPBGA (27×27)
986
XC7S75-L1FGGA484IXC7S75-L1FGGA484IAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)0.92V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
338
Voltage – Supply:
0.92V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
191
XC7S75-L1FGGA676IXC7S75-L1FGGA676IAdvanced Micro DevicesIC FPGA 400 I/O 676FPBGAFPGAs676-FPBGA (27x27)0.92V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
4331520
Number of I/O:
400
Voltage – Supply:
0.92V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FPBGA (27×27)
87
XC7V2000T-1FLG1925CXC7V2000T-1FLG1925CAdvanced Micro DevicesIC FPGA 1200 I/O 1925FCBGAFPGAs1925-FCBGA (45x45)970 mV - 1.03 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
1200
Number of LABs/CLBs:
152700
Number of Logic Elements/Cells:
1954560
Qualification:
N/A
Total RAM Bits:
47628288
641
XC7V2000T-1FLG1925CES9937XC7V2000T-1FLG1925CES9937Advanced Micro DevicesIC FPGA 1200 I/O 1925FCBGAFPGAs1925-FCBGA (45x45)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
152700
Number of Logic Elements/Cells:
1954560
Total RAM Bits:
47628288
Number of I/O:
1200
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1925-FCBGA (45×45)
482
XC7V2000T-2FHG1761CN/AXC7V2000T-2FHG1761CAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAsFHG1761950 mV - 1.05 V0°C – 85°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
1200
Number of LABs/CLBs:
1221600
Number of Logic Elements/Cells:
1954560
Qualification:
N/A
Total RAM Bits:
47628288
616
XC7V2000T-2FLG1925CXC7V2000T-2FLG1925CAdvanced Micro DevicesIC FPGA 1200 I/O 1925FCBGAFPGAs1925-FCBGA (45x45)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
152700
Number of Logic Elements/Cells:
1954560
Total RAM Bits:
47628288
Number of I/O:
1200
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1925-FCBGA (45×45)
354
XC7V2000T-L2FHG1761EXC7V2000T-L2FHG1761EAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAs1761-FCBGA (45x45)0.97V ~ 1.03V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
152700
Number of Logic Elements/Cells:
1954560
Total RAM Bits:
47628288
Number of I/O:
850
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1761-FCBGA (45×45)
1,056
XC7V585T-1FF1157IXC7V585T-1FF1157IAdvanced Micro DevicesIC FPGA 600 I/O 1157FCBGAFPGAs1157-FCBGA (35x35)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
600
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Qualification:
N/A
Total RAM Bits:
29306880
289
XC7V585T-1FF1761IXC7V585T-1FF1761IAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAs1761-FCBGA (42.5x42.5)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
850
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Qualification:
N/A
Total RAM Bits:
29306880
1,150
XC7V585T-1FFG1157CN/AXC7V585T-1FFG1157CAdvanced Micro DevicesIC FPGA 600 I/O 1157FCBGAFPGAsFFG1157950 mV - 1.05 V0°C – 85°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
850
Number of LABs/CLBs:
364200
Number of Logic Elements/Cells:
582720
Qualification:
N/A
Total RAM Bits:
29306880
270
XC7V585T-1FFG1157IXC7V585T-1FFG1157IAdvanced Micro DevicesIC FPGA 600 I/O 1157FCBGAFPGAs1157-FCBGA (35x35)0.97V ~ 1.03V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
600
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1157-FCBGA (35×35)
850
XC7V585T-1FFG1761CXC7V585T-1FFG1761CAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAs1761-FCBGA (42.5x42.5)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
850
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1761-FCBGA (42.5×42.5)
1,230
XC7V585T-1FFG1761IXC7V585T-1FFG1761IAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAs1761-FCBGA (42.5x42.5)0.97V ~ 1.03V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
850
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1761-FCBGA (42.5×42.5)
308
XC7V585T-2FFG1157IXC7V585T-2FFG1157IAdvanced Micro DevicesIC FPGA 600 I/O 1157FCBGAFPGAs1157-FCBGA (35x35)0.97V ~ 1.03V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
600
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1157-FCBGA (35×35)
482
XC7V585T-2FFG1761CXC7V585T-2FFG1761CAdvanced Micro DevicesIC FPGA 850 I/O 1761FCBGAFPGAs1761-FCBGA (42.5x42.5)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
45525
Number of Logic Elements/Cells:
582720
Total RAM Bits:
29306880
Number of I/O:
850
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1761-FCBGA (42.5×42.5)
675

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