Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AAX2000-FGG896IMicrochip TechnologyIC FPGA 586 I/O 896FBGAFPGAs896-FBGA (31x31)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
2000000
Number of I/O:
586
Number of LABs/CLBs:
32256
Number of Logic Elements/Cells:
32256
Qualification:
N/A
Total RAM Bits:
294912
1,168
N/AAX2000-FGG896MMicrochip TechnologyIC FPGA 586 I/O 896FBGAFPGAs896-FBGA (31x31)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
32256
Total RAM Bits:
294912
Number of I/O:
586
Number of Gates:
2000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
279
N/AAX2000-LG624MMicrochip TechnologyIC FPGA 418 I/O 624CLGAFPGAs624-CLGA (32.5x32.5)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
32256
Total RAM Bits:
294912
Number of I/O:
418
Number of Gates:
2000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
624-BCLGA
Supplier Device Package:
624-CLGA (32.5×32.5)
33
N/AAX250-1CQ208MMicrochip TechnologyIC FPGA 115 I/O 208CQFPFPGAs208-CQFP (75x75)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
115
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
810
N/AAX250-1CQ352MMicrochip TechnologyIC FPGA 198 I/O 352CQFPFPGAs352-CQFP (75x75)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
198
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
352-BFCQFP with Tie Bar
Supplier Device Package:
352-CQFP (75×75)
1,700
AX250-1FG256AX250-1FG256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
138
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
299
AX250-1FG256IAX250-1FG256IMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
250000
Number of I/O:
138
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
374
AX250-1FG256MAX250-1FG256MMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
138
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
1,470
AX250-1FG484AX250-1FG484Microchip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
248
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,534
AX250-1FG484IAX250-1FG484IMicrochip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
248
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
519
AX250-1FG484MAX250-1FG484MMicrochip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
248
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
943
AX250-1FGG256AX250-1FGG256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
138
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
751
AX250-1FGG256IAX250-1FGG256IMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
250000
Number of I/O:
138
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
875
AX250-1FGG256MAX250-1FGG256MMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
138
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
74
AX250-1FGG484AX250-1FGG484Microchip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
248
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
692
AX250-1FGG484IAX250-1FGG484IMicrochip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
248
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,214
AX250-1FGG484MAX250-1FGG484MMicrochip TechnologyIC FPGA 248 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
248
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
681
AX250-1PQ208MAX250-1PQ208MMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
250000
Number of I/O:
115
Number of LABs/CLBs:
4224
Number of Logic Elements/Cells:
4224
Qualification:
N/A
Total RAM Bits:
55296
225
AX250-1PQG208MAX250-1PQG208MMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
115
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
744
AX250-2FG256AX250-2FG256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
4224
Total RAM Bits:
55296
Number of I/O:
138
Number of Gates:
250000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
1,332

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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