 | | XC3S4000-4FG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 327 | |
 | | XC3S4000-4FG676I | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 542 | |
 | | XC3S4000-4FG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 839 | |
 | | XC3S4000-4FG900I | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 900-FBGA (31×31) | 559 | |
 | | XC3S4000-4FGG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 799 | |
 | | XC3S4000-4FGG676I | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 62208 | 452 | |
 | | XC3S4000-4FGG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 638 | |
 | | XC3S4000-4FGG900I | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 62208 | 393 | |
 | | XC3S4000-5FG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 635 | |
 | | XC3S4000-5FGG676C | Advanced Micro Devices | IC FPGA 489 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 62208 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,081 | |
 | | XC3S4000-5FGG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 431 | |
 | | XC3S4000L-4FGG900C | Advanced Micro Devices | IC FPGA 633 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 62208 | 396 | |
 | | XC3S400A-4FG320I | Advanced Micro Devices | IC FPGA 251 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 8064 | 598 | |
 | | XC3S400A-4FG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 353 | |
 | | XC3S400A-4FG400I | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 301 | |
 | | XC3S400A-4FGG320C | Advanced Micro Devices | IC FPGA 251 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 320-FBGA (19×19) | 1,083 | |
 | | XC3S400A-4FGG320I | Advanced Micro Devices | IC FPGA 251 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 8064 | 636 | |
 | | XC3S400A-4FGG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 669 | |
 | | XC3S400A-4FGG400I | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 841 | |
 | | XC3S400A-4FT256C | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 616 | |