 | | XC3S400A-4FT256I | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 8064 | 984 | |
 | | XC3S400A-4FTG256C | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 1,133 | |
 | | XC3S400A-4FTG256I | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 8064 | 281 | |
 | | XC3S400A-5FGG320C | Advanced Micro Devices | IC FPGA 251 I/O 320FBGA | FPGAs | 320-FBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 320-FBGA (19×19) | 396 | |
 | | XC3S400A-5FGG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,435 | |
 | | XC3S400A-5FTG256C | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 240 | |
 | | XC3S400AN-4FG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 1,120 | |
 | | XC3S400AN-4FG400I | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 749 | |
 | | XC3S400AN-4FGG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 1,251 | |
 | | XC3S400AN-4FGG400I | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-FBGA (21×21) | 683 | |
 | | XC3S400AN-4FT256I | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 8064 | 572 | |
 | | XC3S400AN-4FTG256C | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 851 | |
 | | XC3S400AN-4FTG256I | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 964 | |
 | | XC3S400AN-5FGG400C | Advanced Micro Devices | IC FPGA 311 I/O 400FBGA | FPGAs | 400-FBGA (21x21) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,406 | |
 | | XC3S400AN-5FTG256C | Advanced Micro Devices | IC FPGA 195 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 8064 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 186 | |
 | | XC3S50-4CPG132C | Advanced Micro Devices | IC FPGA 89 I/O 132CSBGA | FPGAs | 132-CSPBGA (8x8) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8×8) | 207 | |
 | | XC3S50-4CPG132I | Advanced Micro Devices | IC FPGA 89 I/O 132CSBGA | FPGAs | 132-CSPBGA (8x8) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8×8) | 746 | |
 | | XC3S50-4PQ208C | Advanced Micro Devices | IC FPGA 124 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 351 | |
 | | XC3S50-4PQ208I | Advanced Micro Devices | IC FPGA 124 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 296 | |
 | | XC3S50-4PQG208C | Advanced Micro Devices | IC FPGA 124 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 970 | |