 | | 1SG165HN3F43I3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 816 | |
 | | 1SG165HN3F43I3VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 | 1,803 | |
 | | 1SG165HU1F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 | 819 | |
 | | 1SG165HU1F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 24 | |
 | | 1SG165HU2F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 117 | |
 | | 1SG165HU2F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 | 1,892 | |
 | | 1SG165HU3F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,102 | |
 | | 1SG165HU3F50E3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 971 | |
 | | 1SG165HU3F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 516 | |
 | | 1SG165HU3F50I3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 206250 Number of Logic Elements/Cells: 1650000 | 1,036 | |
 | | 1SG166HN1F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 91 | |
 | | 1SG166HN1F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 561 | |
 | | 1SG166HN1F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 525 | |
 | | 1SG166HN1F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,627 | |
 | | 1SG166HN1F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 477 | |
 | | 1SG166HN1F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 55 | |
 | | 1SG166HN2F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,457 | |
 | | 1SG166HN2F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 543 | |
 | | 1SG166HN2F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 | 698 | |
 | | 1SG166HN2F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 207500 Number of Logic Elements/Cells: 1660000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 787 | |