 | | 1SG210HN3F43E3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,581 | |
 | | 1SG210HN3F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 366 | |
 | | 1SG210HN3F43I3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 73 | |
 | | 1SG210HU1F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,955 | |
 | | 1SG210HU1F50E2VGAS | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 596 | |
 | | 1SG210HU1F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 871 | |
 | | 1SG210HU2F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 721 | |
 | | 1SG210HU2F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 488 | |
 | | 1SG210HU3F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 246 | |
 | | 1SG210HU3F50E3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 1,163 | |
 | | 1SG210HU3F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 950 | |
 | | 1SG210HU3F50I3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 89 | |
 | | 1SG211HN1F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 210 | |
 | | 1SG211HN1F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 374 | |
 | | 1SG211HN1F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 153 | |
 | | 1SG211HN1F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 911 | |
 | | 1SG211HN1F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,030 | |
 | | 1SG211HN1F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 144 | |
 | | 1SG211HN2F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 494 | |
 | | 1SG211HN2F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 2,000 | |