 | | 1SG211HN2F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 68 | |
 | | 1SG211HN2F43E2VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 184 | |
 | | 1SG211HN2F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,052 | |
 | | 1SG211HN2F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 440 | |
 | | 1SG211HN2F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 657 | |
 | | 1SG211HN3F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 41 | |
 | | 1SG211HN3F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 67 | |
 | | 1SG211HN3F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 333 | |
 | | 1SG211HN3F43E3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 396 | |
 | | 1SG211HN3F43E3XG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 658 | |
 | | 1SG211HN3F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 39 | |
 | | 1SG211HN3F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 778 | |
 | | 1SG211HN3F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,328 | |
 | | 1SG211HN3F43I3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 1,098 | |
 | | 1SG211HN3F43I3XG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 948 | |
 | | 1SG250HH1F55E1VG | Intel | IC FPGA 1160 I/O 2912BGA | FPGAs | 2912-FBGA, FC (55x55) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 | 1,023 | |
 | | 1SG250HH1F55E2LG | Intel | IC FPGA 1160 I/O 2912BGA | FPGAs | 2912-FBGA, FC (55x55) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55×55) | 345 | |
 | | 1SG250HH1F55E2VG | Intel | IC FPGA 1160 I/O 2912BGA | FPGAs | 2912-FBGA, FC (55x55) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 | 836 | |
 | | 1SG250HH1F55I1VG | Intel | IC FPGA 1160 I/O 2912BGA | FPGAs | 2912-FBGA, FC (55x55) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55×55) | 814 | |
 | | 1SG250HH1F55I2LG | Intel | IC FPGA 1160 I/O 2912BGA | FPGAs | 2912-FBGA, FC (55x55) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55×55) | 1,405 | |