 | | 1SG280HN2F43E2LGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,041 | |
 | | 1SG280HN2F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 709 | |
 | | 1SG280HN2F43E2VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 614 | |
 | | 1SG280HN2F43E2VGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 1,656 | |
 | | 1SG280HN2F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 305 | |
 | | 1SG280HN2F43I1VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 1,557 | |
 | | 1SG280HN2F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 1,109 | |
 | | 1SG280HN2F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 725 | |
 | | 1SG280HN3F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 879 | |
 | | 1SG280HN3F43E1VGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 659 | |
 | | 1SG280HN3F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 515 | |
 | | 1SG280HN3F43E2LGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 302 | |
 | | 1SG280HN3F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 40 | |
 | | 1SG280HN3F43E2VGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 759 | |
 | | 1SG280HN3F43E3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 791 | |
 | | 1SG280HN3F43E3VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 12 | |
 | | 1SG280HN3F43E3VGS3 | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 60 | |
 | | 1SG280HN3F43E3XG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 755 | |
 | | 1SG280HN3F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 407 | |
 | | 1SG280HN3F43I1VGAS | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 300 | |