 | | 1SG280HU2F50E2LGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 841 | |
 | | 1SG280HU2F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 1,492 | |
 | | 1SG280HU2F50E2VGAS | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,335 | |
 | | 1SG280HU2F50E2VGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 404 | |
 | | 1SG280HU2F50I1VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 1,726 | |
 | | 1SG280HU2F50I2LG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,016 | |
 | | 1SG280HU2F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 50 | |
 | | 1SG280HU3F50E1VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 465 | |
 | | 1SG280HU3F50E1VGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,200 | |
 | | 1SG280HU3F50E2LG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,262 | |
 | | 1SG280HU3F50E2LGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 763 | |
 | | 1SG280HU3F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 263 | |
 | | 1SG280HU3F50E2VGAS | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 36 | |
 | | 1SG280HU3F50E2VGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 539 | |
 | | 1SG280HU3F50E3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 578 | |
 | | 1SG280HU3F50E3VGS3 | Intel | IC FPGA 704 I/O 2397FBGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 223 | |
 | | 1SG280HU3F50E3XG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 768 | |
 | | 1SG280HU3F50I1VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 400 | |
 | | 1SG280HU3F50I2LG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 | 229 | |
 | | 1SG280HU3F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 586 | |