Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP3CLS150F780C8N
EP3CLS150F780C8NIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9428
Number of Logic Elements/Cells:
150848
Total RAM Bits:
6137856
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
726
EP3CLS150F780I7
EP3CLS150F780I7IntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9428
Number of Logic Elements/Cells:
150848
Total RAM Bits:
6137856
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
232
EP3CLS150F780I7N
EP3CLS150F780I7NIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9428
Number of Logic Elements/Cells:
150848
Total RAM Bits:
6137856
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
720
EP3CLS200F484C7EP3CLS200F484C7IntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Qualification:
N/A
Total RAM Bits:
8211456
221
EP3CLS200F484C7NEP3CLS200F484C7NIntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Qualification:
N/A
Total RAM Bits:
8211456
962
EP3CLS200F484C8
EP3CLS200F484C8IntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
210
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
743
EP3CLS200F484C8ES
EP3CLS200F484C8ESIntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
210
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,477
EP3CLS200F484C8N
EP3CLS200F484C8NIntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
210
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
33
EP3CLS200F484I7EP3CLS200F484I7IntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Qualification:
N/A
Total RAM Bits:
8211456
1,097
EP3CLS200F484I7NEP3CLS200F484I7NIntelIC FPGA 210 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Qualification:
N/A
Total RAM Bits:
8211456
653
EP3CLS200F780C7EP3CLS200F780C7IntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
413
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Qualification:
N/A
Total RAM Bits:
8211456
222
EP3CLS200F780C7N
EP3CLS200F780C7NIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
98
EP3CLS200F780C8
EP3CLS200F780C8IntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
735
EP3CLS200F780C8ES
EP3CLS200F780C8ESIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
1,434
EP3CLS200F780C8N
EP3CLS200F780C8NIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
828
EP3CLS200F780I7
EP3CLS200F780I7IntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
1,063
EP3CLS200F780I7N
EP3CLS200F780I7NIntelIC FPGA 413 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
12404
Number of Logic Elements/Cells:
198464
Total RAM Bits:
8211456
Number of I/O:
413
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
471
EP3CLS70F484C7
EP3CLS70F484C7IntelIC FPGA 278 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4388
Number of Logic Elements/Cells:
70208
Total RAM Bits:
3068928
Number of I/O:
278
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
947
EP3CLS70F484C7NEP3CLS70F484C7NIntelIC FPGA 278 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
278
Number of LABs/CLBs:
4388
Number of Logic Elements/Cells:
70208
Qualification:
N/A
Total RAM Bits:
3068928
536
EP3CLS70F484C8EP3CLS70F484C8IntelIC FPGA 278 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
278
Number of LABs/CLBs:
4388
Number of Logic Elements/Cells:
70208
Qualification:
N/A
Total RAM Bits:
3068928
1,993

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