Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP3SE260F1517C3NEP3SE260F1517C3NIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
1,642
EP3SE260F1517C4EP3SE260F1517C4IntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
1,542
EP3SE260F1517C4GEP3SE260F1517C4GIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
727
EP3SE260F1517C4L
EP3SE260F1517C4LIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
976
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,361
EP3SE260F1517C4LGEP3SE260F1517C4LGIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
444
EP3SE260F1517C4LNEP3SE260F1517C4LNIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
792
EP3SE260F1517C4N
EP3SE260F1517C4NIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
976
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,193
EP3SE260F1517I3EP3SE260F1517I3IntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
799
EP3SE260F1517I3GEP3SE260F1517I3GIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
961
EP3SE260F1517I3NEP3SE260F1517I3NIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
874
EP3SE260F1517I4
EP3SE260F1517I4IntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
976
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,339
EP3SE260F1517I4GEP3SE260F1517I4GIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
350
EP3SE260F1517I4LEP3SE260F1517I4LIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
580
EP3SE260F1517I4LN
EP3SE260F1517I4LNIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
976
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
631
EP3SE260F1517I4NEP3SE260F1517I4NIntelIC FPGA 976 I/O 1517FBGAFPGAs1517-FBGA (40x40)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
976
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
204
EP3SE260H780C2
EP3SE260H780C2IntelIC FPGA 488 I/O 780HBGAFPGAs780-HBGA (33x33)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-HBGA (33×33)
1,819
EP3SE260H780C2GEP3SE260H780C2GIntelIC FPGA 488 I/O 780HBGAFPGAs780-HBGA (33x33)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
1,138
EP3SE260H780C2N
EP3SE260H780C2NIntelIC FPGA 488 I/O 780HBGAFPGAs780-HBGA (33x33)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-HBGA (33×33)
1,868
EP3SE260H780C3
EP3SE260H780C3IntelIC FPGA 488 I/O 780HBGAFPGAs780-HBGA (33x33)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Total RAM Bits:
16672768
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-HBGA (33×33)
243
EP3SE260H780C3GEP3SE260H780C3GIntelIC FPGA 488 I/O 780HBGAFPGAs780-HBGA (33x33)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
10200
Number of Logic Elements/Cells:
255000
Qualification:
N/A
Total RAM Bits:
16672768
1,572

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