Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
EP3SL70F484I3GIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
1,221
EP3SL70F484I3N
EP3SL70F484I3NIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
438
EP3SL70F484I4
EP3SL70F484I4IntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
455
N/AN/AEP3SL70F484I4GIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
1,119
EP3SL70F484I4L
EP3SL70F484I4LIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
1,542
N/AN/AEP3SL70F484I4LGIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
286
EP3SL70F484I4LNEP3SL70F484I4LNIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)860 mV - 1.15 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
600
EP3SL70F484I4N
EP3SL70F484I4NIntelIC FPGA 296 I/O 484FBGAFPGAs484-FBGA (23x23)0.86V ~ 1.15V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
296
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FBGA (23×23)
1,087
EP3SL70F780C2
EP3SL70F780C2IntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,296
EP3SL70F780C2GN/AEP3SL70F780C2GIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
264
EP3SL70F780C2NEP3SL70F780C2NIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
242
EP3SL70F780C3
EP3SL70F780C3IntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
186
EP3SL70F780C3GEP3SL70F780C3GIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
661
EP3SL70F780C3N
EP3SL70F780C3NIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
258
EP3SL70F780C3NACN/AEP3SL70F780C3NACIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
543
EP3SL70F780C4
EP3SL70F780C4IntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
556
EP3SL70F780C4GEP3SL70F780C4GIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
795
EP3SL70F780C4L
EP3SL70F780C4LIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)0.86V ~ 1.15V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Total RAM Bits:
2699264
Number of I/O:
488
Voltage – Supply:
0.86V ~ 1.15V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
612
EP3SL70F780C4LGEP3SL70F780C4LGIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
1,107
EP3SL70F780C4LNEP3SL70F780C4LNIntelIC FPGA 488 I/O 780FBGAFPGAs780-FBGA (29x29)860 mV - 1.15 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
488
Number of LABs/CLBs:
2700
Number of Logic Elements/Cells:
67500
Qualification:
N/A
Total RAM Bits:
2699264
1,610

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