Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S5000-4FGG900IXC3S5000-4FGG900IAdvanced Micro DevicesIC FPGA 633 I/O 900FBGAFPGAs900-FBGA (31x31)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
5000000
Number of I/O:
633
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Qualification:
N/A
Total RAM Bits:
1916928
504
XC3S5000-5FG676CXC3S5000-5FG676CAdvanced Micro DevicesIC FPGA 489 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5000000
Number of I/O:
489
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Qualification:
N/A
Total RAM Bits:
1916928
729
XC3S5000-5FG900CXC3S5000-5FG900CAdvanced Micro DevicesIC FPGA 633 I/O 900FBGAFPGAs900-FBGA (31x31)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5000000
Number of I/O:
633
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Qualification:
N/A
Total RAM Bits:
1916928
276
XC3S5000-5FGG676CXC3S5000-5FGG676CAdvanced Micro DevicesIC FPGA 489 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Total RAM Bits:
1916928
Number of I/O:
489
Number of Gates:
5000000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,112
XC3S5000-5FGG900CXC3S5000-5FGG900CAdvanced Micro DevicesIC FPGA 633 I/O 900FBGAFPGAs900-FBGA (31x31)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5000000
Number of I/O:
633
Number of LABs/CLBs:
8320
Number of Logic Elements/Cells:
74880
Qualification:
N/A
Total RAM Bits:
1916928
593
XC3S500E-4CP132IXC3S500E-4CP132IAdvanced Micro DevicesIC FPGA 92 I/O 132CSBGAFPGAs132-CSPBGA (8x8)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
92
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
132-TFBGA, CSPBGA
Supplier Device Package:
132-CSPBGA (8×8)
710
XC3S500E-4CPG132CXC3S500E-4CPG132CAdvanced Micro DevicesIC FPGA 92 I/O 132CSBGAFPGAs132-CSPBGA (8x8)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
92
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
132-TFBGA, CSPBGA
Supplier Device Package:
132-CSPBGA (8×8)
110
XC3S500E-4CPG132IXC3S500E-4CPG132IAdvanced Micro DevicesIC FPGA 92 I/O 132CSBGAFPGAs132-CSPBGA (8x8)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
92
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
N/A
Total RAM Bits:
368640
624
XC3S500E-4FG320CXC3S500E-4FG320CAdvanced Micro DevicesIC FPGA 232 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
232
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
N/A
Total RAM Bits:
368640
99
XC3S500E-4FG320IXC3S500E-4FG320IAdvanced Micro DevicesIC FPGA 232 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
232
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
1,533
XC3S500E-4FGG320CXC3S500E-4FGG320CAdvanced Micro DevicesIC FPGA 232 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
232
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
99
XC3S500E-4FGG320IXC3S500E-4FGG320IAdvanced Micro DevicesIC FPGA 232 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
232
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
194
XC3S500E-4FT256CXC3S500E-4FT256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
190
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
598
XC3S500E-4FT256IXC3S500E-4FT256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
190
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,254
XC3S500E-4FTG256CXC3S500E-4FTG256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
190
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
N/A
Total RAM Bits:
368640
840
XC3S500E-4FTG256IXC3S500E-4FTG256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
190
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,275
XC3S500E-4PQ208CXC3S500E-4PQ208CAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
158
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,493
XC3S500E-4PQ208IXC3S500E-4PQ208IAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
158
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,558
XC3S500E-4PQG208CXC3S500E-4PQG208CAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
158
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
N/A
Total RAM Bits:
368640
1,610
XC3S500E-4PQG208IXC3S500E-4PQG208IAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
158
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
N/A
Total RAM Bits:
368640
114

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