Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S50A-5TQG144CXC3S50A-5TQG144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
108
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
421
XC3S50A-5VQG100CXC3S50A-5VQG100CAdvanced Micro DevicesIC FPGA 68 I/O 100VQFPFPGAs100-VQFP (14x14)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
68
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
128
XC3S50AN-4FT256CXC3S50AN-4FT256CAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
722
XC3S50AN-4FT256IXC3S50AN-4FT256IAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
764
XC3S50AN-4FTG256CXC3S50AN-4FTG256CAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,563
XC3S50AN-4FTG256IXC3S50AN-4FTG256IAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
50000
Number of I/O:
195
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
1,021
XC3S50AN-4TQ144IXC3S50AN-4TQ144IAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
108
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
673
XC3S50AN-4TQG144CXC3S50AN-4TQG144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
108
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
394
XC3S50AN-4TQG144IXC3S50AN-4TQG144IAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
108
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,058
XC3S50AN-5FT256CXC3S50AN-5FT256CAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
77
XC3S50AN-5FTG256CXC3S50AN-5FTG256CAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
938
XC3S50AN-5TQG144CXC3S50AN-5TQG144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
108
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
961
XC3S700A-4FG400CXC3S700A-4FG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
311
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
718
XC3S700A-4FG400IXC3S700A-4FG400IAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
572
XC3S700A-4FG484CXC3S700A-4FG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
286
XC3S700A-4FG484IXC3S700A-4FG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
634
XC3S700A-4FGG400CXC3S700A-4FGG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
347
XC3S700A-4FGG400IXC3S700A-4FGG400IAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
611
XC3S700A-4FGG484CXC3S700A-4FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
699
XC3S700A-4FGG484IXC3S700A-4FGG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
672

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