Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S700A-4FT256IXC3S700A-4FT256IAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
161
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
205
XC3S700A-4FTG256CXC3S700A-4FTG256CAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
161
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
843
XC3S700A-4FTG256IXC3S700A-4FTG256IAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
161
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
327
XC3S700A-5FGG400CXC3S700A-5FGG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
311
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,442
XC3S700A-5FGG484CXC3S700A-5FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
237
XC3S700A-5FTG256CXC3S700A-5FTG256CAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
161
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,080
XC3S700AN-4FG484CXC3S700AN-4FG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
55
XC3S700AN-4FG484IXC3S700AN-4FG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
474
XC3S700AN-4FGG484CXC3S700AN-4FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
776
XC3S700AN-4FGG484IXC3S700AN-4FGG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,237
XC3S700AN-5FGG484CXC3S700AN-5FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
491
XC3SD1800A-4CS484LIXC3SD1800A-4CS484LIAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Total RAM Bits:
1548288
Number of I/O:
309
Number of Gates:
1800000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
778
XC3SD1800A-4CSG484CXC3SD1800A-4CSG484CAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1800000
Number of I/O:
309
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
N/A
Total RAM Bits:
1548288
1,542
XC3SD1800A-4CSG484IXC3SD1800A-4CSG484IAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1800000
Number of I/O:
309
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
N/A
Total RAM Bits:
1548288
931
XC3SD1800A-4CSG484LIXC3SD1800A-4CSG484LIAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Total RAM Bits:
1548288
Number of I/O:
309
Number of Gates:
1800000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
707
XC3SD1800A-4FG676IXC3SD1800A-4FG676IAdvanced Micro DevicesIC FPGA 519 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Total RAM Bits:
1548288
Number of I/O:
519
Number of Gates:
1800000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,971
XC3SD1800A-4FGG676CXC3SD1800A-4FGG676CAdvanced Micro DevicesIC FPGA 519 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1800000
Number of I/O:
519
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
N/A
Total RAM Bits:
1548288
701
XC3SD1800A-4FGG676IXC3SD1800A-4FGG676IAdvanced Micro DevicesIC FPGA 519 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1800000
Number of I/O:
519
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
N/A
Total RAM Bits:
1548288
971
XC3SD1800A-5CSG484CXC3SD1800A-5CSG484CAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Total RAM Bits:
1548288
Number of I/O:
309
Number of Gates:
1800000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
267
XC3SD1800A-5FGG676CXC3SD1800A-5FGG676CAdvanced Micro DevicesIC FPGA 519 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1800000
Number of I/O:
519
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
N/A
Total RAM Bits:
1548288
963

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