Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCKU19P-L2FFVB2104EXCKU19P-L2FFVB2104EAdvanced Micro DevicesIC FPGA KINTEX UP LP 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
540
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Qualification:
N/A
Total RAM Bits:
63753421
434
XCKU19P-L2FFVJ1760EXCKU19P-L2FFVJ1760EAdvanced Micro DevicesIC FPGA KINTEX UP LP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Total RAM Bits:
63753421
Number of I/O:
540
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
95
XCKU3P-1FFVA676EN/AXCKU3P-1FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
305
XCKU3P-1FFVB676EN/AXCKU3P-1FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
782
XCKU3P-1FFVB676IN/AXCKU3P-1FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
180
XCKU3P-1FFVD900EN/AXCKU3P-1FFVD900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
470
XCKU3P-1FFVD900IN/AXCKU3P-1FFVD900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
225
XCKU3P-1SFVB784EN/AXCKU3P-1SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
1,426
XCKU3P-1SFVB784IN/AXCKU3P-1SFVB784IAdvanced Micro DevicesIC FPGA 256 I/O 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
443
XCKU3P-2FFVA676EN/AXCKU3P-2FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
256
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,064
XCKU3P-2FFVA676IN/AXCKU3P-2FFVA676IAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
831
XCKU3P-2FFVB676EN/AXCKU3P-2FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,257
XCKU3P-2FFVB676IN/AXCKU3P-2FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,672
XCKU3P-2FFVD900EN/AXCKU3P-2FFVD900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
719
XCKU3P-2FFVD900IN/AXCKU3P-2FFVD900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31×31)
737
XCKU3P-2SFVB784EN/AXCKU3P-2SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
1,259
XCKU3P-2SFVB784IN/AXCKU3P-2SFVB784IAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
852
XCKU3P-3FFVA676EN/AXCKU3P-3FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
256
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
327
XCKU3P-3FFVB676EN/AXCKU3P-3FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
817
XCKU3P-L1FFVB676IN/AXCKU3P-L1FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.698V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
114

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up