Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXCV800-6HQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
114688
Number of I/O:
166
Number of Gates:
888439
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
89
N/AXCV812E-6BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
1146880
Number of I/O:
404
Number of Gates:
254016
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
948
N/AXCV812E-7BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Total RAM Bits:
1146880
Number of I/O:
404
Number of Gates:
254016
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,356
N/AXCV812E-8BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
254016
Number of I/O:
404
Number of LABs/CLBs:
4704
Number of Logic Elements/Cells:
21168
Qualification:
N/A
Total RAM Bits:
1146880
269
XCVU065-2FFVC1517IXCVU065-2FFVC1517IAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)922 mV - 979 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
520
Number of LABs/CLBs:
44760
Number of Logic Elements/Cells:
783300
Qualification:
N/A
Total RAM Bits:
45363200
928
XCVU065-H1FFVC1517EXCVU065-H1FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)0.922V ~ 1.030V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
44760
Number of Logic Elements/Cells:
783300
Total RAM Bits:
45363200
Number of I/O:
520
Voltage – Supply:
0.922V ~ 1.030V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40×40)
313
N/AXCVU080-1FFVA2104IAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)922 mV - 979 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Qualification:
N/A
Total RAM Bits:
51200000
1,940
N/AXCVU080-2FFVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.922V ~ 0.979V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Total RAM Bits:
51200000
Number of I/O:
832
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
967
N/AXCVU080-2FFVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)922 mV - 979 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Qualification:
N/A
Total RAM Bits:
51200000
191
XCVU080-2FFVD1517EXCVU080-2FFVD1517EAdvanced Micro DevicesIC FPGA 338 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)0.922V ~ 0.979V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Total RAM Bits:
51200000
Number of I/O:
338
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40×40)
766
N/AXCVU080-3FFVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.970V ~ 1.030V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
55714
Number of Logic Elements/Cells:
975000
Total RAM Bits:
51200000
Number of I/O:
832
Voltage – Supply:
0.970V ~ 1.030V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
269
N/AN/AXCVU095-2FFVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFFVA2104922 mV - 979 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
537600
Number of Logic Elements/Cells:
1176000
Qualification:
N/A
Total RAM Bits:
63753421
559
N/AXCVU095-2FFVA2104IAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.922V ~ 0.979V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Total RAM Bits:
62259200
Number of I/O:
832
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
385
XCVU095-2FFVB1760EXCVU095-2FFVB1760EAdvanced Micro DevicesIC FPGA 702 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.922V ~ 0.979V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Total RAM Bits:
62259200
Number of I/O:
702
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
570
XCVU095-2FFVB1760IXCVU095-2FFVB1760IAdvanced Micro DevicesIC FPGA 702 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.922V ~ 0.979V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Total RAM Bits:
62259200
Number of I/O:
702
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
964
N/AXCVU095-2FFVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)922 mV - 979 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Qualification:
N/A
Total RAM Bits:
62259200
613
N/AXCVU095-2FFVB2104IAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.922V ~ 0.979V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Total RAM Bits:
62259200
Number of I/O:
702
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
939
XCVU095-2FFVC1517EN/AXCVU095-2FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAsFFVC1517922 mV - 979 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
537600
Number of Logic Elements/Cells:
1176000
Qualification:
N/A
Total RAM Bits:
63753421
1,032
XCVU095-2FFVC1517IN/AXCVU095-2FFVC1517IAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAsFFVC1517922 mV - 979 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
537600
Number of Logic Elements/Cells:
1176000
Qualification:
N/A
Total RAM Bits:
63753421
75
N/AXCVU095-2FFVC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)922 mV - 979 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
67200
Number of Logic Elements/Cells:
1176000
Qualification:
N/A
Total RAM Bits:
62259200
761

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