Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCVU23P-3FSVJ1760EN/AXCVU23P-3FSVJ1760EAdvanced Micro DevicesIC FPGA VIRTEX-UP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
128700
Number of Logic Elements/Cells:
2252250
Total RAM Bits:
77909197
Number of I/O:
644
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
984
XCVU23P-3VSVA1365EN/AXCVU23P-3VSVA1365EAdvanced Micro DevicesIC FPGA VIRTEX-UP 1365FCBGAFPGAs1365-FCBGA (35x35)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
128700
Number of Logic Elements/Cells:
2252250
Total RAM Bits:
77909197
Number of I/O:
364
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1365-BFBGA, FCBGA
Supplier Device Package:
1365-FCBGA (35×35)
594
XCVU23P-L2FSVJ1760EN/AXCVU23P-L2FSVJ1760EAdvanced Micro DevicesIC FPGA VIRTEX-UP LP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
644
Number of LABs/CLBs:
128700
Number of Logic Elements/Cells:
2252250
Qualification:
N/A
Total RAM Bits:
77909197
1,057
XCVU23P-L2VSVA1365EN/AXCVU23P-L2VSVA1365EAdvanced Micro DevicesIC FPGA VIRTEX-UP LP 1365FCBGAFPGAs1365-FCBGA (35x35)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
364
Number of LABs/CLBs:
128700
Number of Logic Elements/Cells:
2252250
Qualification:
N/A
Total RAM Bits:
77909197
191
N/AN/AXCVU27P-1FIGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (52.5x52.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
676
Number of LABs/CLBs:
162000
Number of Logic Elements/Cells:
2835000
Qualification:
N/A
Total RAM Bits:
74344038
1,329
N/AN/AXCVU27P-2FSGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162000
Number of Logic Elements/Cells:
2835000
Total RAM Bits:
74344038
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
1,171
N/AN/AXCVU27P-3FIGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (52.5x52.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162000
Number of Logic Elements/Cells:
2835000
Total RAM Bits:
74344038
Number of I/O:
676
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (52.5×52.5)
64
N/AN/AXCVU27P-L2FSGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.698V ~ 0.742V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162000
Number of Logic Elements/Cells:
2835000
Total RAM Bits:
74344038
Number of I/O:
448
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
800
N/AN/AXCVU29P-1FIGD2104IAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (52.5x52.5)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
676
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Qualification:
N/A
Total RAM Bits:
99090432
778
N/AN/AXCVU29P-2FIGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (52.5x52.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
676
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Qualification:
N/A
Total RAM Bits:
99090432
957
N/AN/AXCVU29P-2FIGD2104IAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (52.5x52.5)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Total RAM Bits:
99090432
Number of I/O:
676
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (52.5×52.5)
1,505
N/AXCVU29P-2FSGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Total RAM Bits:
99090432
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
787
N/AN/AXCVU29P-2FSGA2577IAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Total RAM Bits:
99090432
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
1,431
N/AN/AXCVU29P-3FSGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Qualification:
N/A
Total RAM Bits:
99090432
237
N/AN/AXCVU29P-L2FSGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.698V ~ 0.742V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
216000
Number of Logic Elements/Cells:
3780000
Total RAM Bits:
99090432
Number of I/O:
448
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
1,026
N/AXCVU31P-1FSVH1924EAdvanced Micro DevicesIC FPGA 208 I/O 1924FCBGAFPGAs1924-FCBGA (45x45)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1924-FCBGA (45×45)
1,348
N/AXCVU31P-2FSVH1924EAdvanced Micro DevicesIC FPGA 208 I/O 1924FCBGAFPGAs1924-FCBGA (45x45)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
208
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Qualification:
N/A
Total RAM Bits:
24746394
380
N/AXCVU31P-3FSVH1924EAdvanced Micro DevicesIC FPGA 208 I/O 1924FCBGAFPGAs1924-FCBGA (45x45)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1924-FCBGA (45×45)
884
N/AXCVU31P-L2FSVH1924EAdvanced Micro DevicesIC FPGA 208 I/O 1924FCBGAFPGAs1924-FCBGA (45x45)698 mV - 742 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
208
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Qualification:
N/A
Total RAM Bits:
24746394
684
N/AXCVU33P-1FSVH2104EAdvanced Micro DevicesIC FPGA 208 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,568

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