Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXCVU33P-2FSVH2104EAdvanced Micro DevicesIC FPGA 208 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,227
N/AXCVU33P-3FSVH2104EAdvanced Micro DevicesIC FPGA 208 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
425
N/AXCVU35P-1FSVH2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Total RAM Bits:
49597645
Number of I/O:
416
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
453
XCVU35P-1FSVH2892EXCVU35P-1FSVH2892EAdvanced Micro DevicesIC FPGA 416 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Qualification:
N/A
Total RAM Bits:
49597645
660
N/AXCVU35P-2FSVH2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Qualification:
N/A
Total RAM Bits:
49597645
1,110
XCVU35P-2FSVH2892EXCVU35P-2FSVH2892EAdvanced Micro DevicesIC FPGA 416 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Total RAM Bits:
49597645
Number of I/O:
416
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
693
N/AXCVU35P-3FSVH2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)873 mV - 927 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Qualification:
N/A
Total RAM Bits:
49597645
661
XCVU35P-3FSVH2892EXCVU35P-3FSVH2892EAdvanced Micro DevicesIC FPGA 416 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Total RAM Bits:
49597645
Number of I/O:
416
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
305
N/AXCVU35P-L2FSVH2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)698 mV - 742 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Qualification:
N/A
Total RAM Bits:
49597645
139
XCVU35P-L2FSVH2892EXCVU35P-L2FSVH2892EAdvanced Micro DevicesIC FPGA 416 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.698V ~ 0.742V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
108960
Number of Logic Elements/Cells:
1906800
Total RAM Bits:
49597645
Number of I/O:
416
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
516
XCVU37P-1FSVH2892EXCVU37P-1FSVH2892EAdvanced Micro DevicesIC FPGA 624 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
1,350
XCVU37P-2FSVH2892EXCVU37P-2FSVH2892EAdvanced Micro DevicesIC FPGA 624 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
182
XCVU37P-3FSVH2892EXCVU37P-3FSVH2892EAdvanced Micro DevicesIC FPGA 624 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
1,336
XCVU37P-L2FSVH2892EXCVU37P-L2FSVH2892EAdvanced Micro DevicesIC FPGA 624 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.698V ~ 0.742V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
961
XCVU3P-1FFVC1517EXCVU3P-1FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
520
Number of LABs/CLBs:
49260
Number of Logic Elements/Cells:
862050
Qualification:
N/A
Total RAM Bits:
130355200
1,477
XCVU3P-2FFVC1517EXCVU3P-2FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
520
Number of LABs/CLBs:
49260
Number of Logic Elements/Cells:
862050
Qualification:
N/A
Total RAM Bits:
130355200
384
XCVU3P-2FFVC1517IN/AXCVU3P-2FFVC1517IAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
49260
Number of Logic Elements/Cells:
862050
Total RAM Bits:
118067200
Number of I/O:
520
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40×40)
672
XCVU3P-3FFVC1517EN/AXCVU3P-3FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)873 mV - 927 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
520
Number of LABs/CLBs:
49260
Number of Logic Elements/Cells:
862050
Qualification:
N/A
Total RAM Bits:
118067200
861
XCVU3P-L2FFVC1517EN/AXCVU3P-L2FFVC1517EAdvanced Micro DevicesIC FPGA 520 I/O 1517FCBGAFPGAs1517-FCBGA (40x40)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
520
Number of LABs/CLBs:
49260
Number of Logic Elements/Cells:
862050
Qualification:
N/A
Total RAM Bits:
130355200
354
N/AXCVU440-1FLGA2892CAdvanced Micro DevicesIC FPGA 1456 I/O 2892FCBGAFPGAs2892-FCBGA (55x55)0.922V ~ 0.979V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
316620
Number of Logic Elements/Cells:
5540850
Total RAM Bits:
90726400
Number of I/O:
1456
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
2892-BBGA, FCBGA
Supplier Device Package:
2892-FCBGA (55×55)
242

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