 | | 1SG210HN3F43E3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,487 | |
 | | 1SG210HN3F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 188 | |
 | | 1SG210HN3F43I3VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 1,028 | |
 | | 1SG210HU1F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,582 | |
 | | 1SG210HU1F50E2VGAS | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 596 | |
 | | 1SG210HU1F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 428 | |
 | | 1SG210HU2F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 538 | |
 | | 1SG210HU2F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 319 | |
 | | 1SG210HU3F50E2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 875 | |
 | | 1SG210HU3F50E3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | 0°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 1,131 | |
 | | 1SG210HU3F50I2VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 | 939 | |
 | | 1SG210HU3F50I3VG | Intel | IC FPGA 704 I/O 2397BGA | FPGAs | 2397-FBGA, FC (50x50) | 0.77V ~ 0.97V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50×50) | 1,761 | |
 | | 1SG211HN1F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,573 | |
 | | 1SG211HN1F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 820 mV - 880 mV | 0°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 374 | |
 | | 1SG211HN1F43E2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,011 | |
 | | 1SG211HN1F43I1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 911 | |
 | | 1SG211HN1F43I2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,030 | |
 | | 1SG211HN1F43I2VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 770 mV - 970 mV | -40°C – 100°C | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 | 5 | |
 | | 1SG211HN2F43E1VG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.77V ~ 0.97V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 198 | |
 | | 1SG211HN2F43E2LG | Intel | IC FPGA 688 I/O 1760FBGA | FPGAs | 1760-FBGA (42.5x42.5) | 0.82V ~ 0.88V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 263750 Number of Logic Elements/Cells: 2110000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5×42.5) | 1,555 | |