Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
1SG280HU2F50E2LGS3
1SG280HU2F50E2LGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)0.82V ~ 0.88V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
841
1SG280HU2F50E2VG1SG280HU2F50E2VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
1,148
1SG280HU2F50E2VGAS
1SG280HU2F50E2VGASIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
1,335
1SG280HU2F50E2VGS3
1SG280HU2F50E2VGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
404
1SG280HU2F50I1VG1SG280HU2F50I1VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
1,557
1SG280HU2F50I2LG
1SG280HU2F50I2LGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
1,016
1SG280HU2F50I2VG1SG280HU2F50I2VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
50
1SG280HU3F50E1VG1SG280HU3F50E1VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
465
1SG280HU3F50E1VGS3
1SG280HU3F50E1VGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
1,200
1SG280HU3F50E2LG
1SG280HU3F50E2LGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.82V ~ 0.88V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
1,262
1SG280HU3F50E2LGS3
1SG280HU3F50E2LGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)0.82V ~ 0.88V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
763
1SG280HU3F50E2VG
1SG280HU3F50E2VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
239
1SG280HU3F50E2VGAS1SG280HU3F50E2VGASIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
23
1SG280HU3F50E2VGS31SG280HU3F50E2VGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
539
1SG280HU3F50E3VG
1SG280HU3F50E3VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
208
1SG280HU3F50E3VGS3
1SG280HU3F50E3VGS3IntelIC FPGA 704 I/O 2397FBGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
56
1SG280HU3F50E3XG
1SG280HU3F50E3XGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.82V ~ 0.88V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
376
1SG280HU3F50I1VG1SG280HU3F50I1VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
400
1SG280HU3F50I2LG1SG280HU3F50I2LGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
90
1SG280HU3F50I2VG
1SG280HU3F50I2VGIntelIC FPGA 704 I/O 2397BGAFPGAs2397-FBGA, FC (50x50)0.77V ~ 0.97V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
704
Voltage – Supply:
0.77V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50×50)
586

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