Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S1200E-4FG320IXC3S1200E-4FG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
250
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,251
N/AXC3S1200E-4FG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,844
XC3S1200E-4FG400IXC3S1200E-4FG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
579
XC3S1200E-4FGG320CXC3S1200E-4FGG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
250
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
131
XC3S1200E-4FGG320IXC3S1200E-4FGG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
250
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
676
XC3S1200E-4FGG400CXC3S1200E-4FGG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
304
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,118
XC3S1200E-4FGG400IXC3S1200E-4FGG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
304
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,056
XC3S1200E-4FT256CXC3S1200E-4FT256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
577
XC3S1200E-4FT256IXC3S1200E-4FT256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,446
XC3S1200E-4FTG256CXC3S1200E-4FTG256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
602
XC3S1200E-4FTG256IXC3S1200E-4FTG256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
190
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,215
N/AXC3S1200E-5FG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
506
XC3S1200E-5FGG320CXC3S1200E-5FGG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
250
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
905
XC3S1200E-5FGG400CXC3S1200E-5FGG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
111
XC3S1200E-5FT256CXC3S1200E-5FT256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
190
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
485
XC3S1200E-5FTG256CXC3S1200E-5FTG256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
190
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
922
XC3S1400A-4FG484CXC3S1400A-4FG484CAdvanced Micro DevicesIC FPGA 375 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Total RAM Bits:
589824
Number of I/O:
375
Number of Gates:
1400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
583
XC3S1400A-4FG484IXC3S1400A-4FG484IAdvanced Micro DevicesIC FPGA 375 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Total RAM Bits:
589824
Number of I/O:
375
Number of Gates:
1400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
910
XC3S1400A-4FG676CXC3S1400A-4FG676CAdvanced Micro DevicesIC FPGA 502 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Total RAM Bits:
589824
Number of I/O:
502
Number of Gates:
1400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
425
XC3S1400A-4FG676IXC3S1400A-4FG676IAdvanced Micro DevicesIC FPGA 502 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1400000
Number of I/O:
502
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Qualification:
N/A
Total RAM Bits:
589824
447

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up