Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S1400AN-5FGG676CXC3S1400AN-5FGG676CAdvanced Micro DevicesIC FPGA 502 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Total RAM Bits:
589824
Number of I/O:
502
Number of Gates:
1400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
213
XC3S1500-4FG320IXC3S1500-4FG320IAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
221
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
1,631
XC3S1500-4FG456CXC3S1500-4FG456CAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
63
XC3S1500-4FG456IXC3S1500-4FG456IAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
333
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
1,460
XC3S1500-4FG676CXC3S1500-4FG676CAdvanced Micro DevicesIC FPGA 487 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
146
XC3S1500-4FG676IXC3S1500-4FG676IAdvanced Micro DevicesIC FPGA 487 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
947
XC3S1500-4FGG320CXC3S1500-4FGG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
221
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
1,026
XC3S1500-4FGG320IXC3S1500-4FGG320IAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
221
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
970
XC3S1500-4FGG456CXC3S1500-4FGG456CAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
669
XC3S1500-4FGG456IXC3S1500-4FGG456IAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,432
XC3S1500-4FGG676CXC3S1500-4FGG676CAdvanced Micro DevicesIC FPGA 487 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
794
XC3S1500-4FGG676IXC3S1500-4FGG676IAdvanced Micro DevicesIC FPGA 487 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
487
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
675
XC3S1500-5FG456CXC3S1500-5FG456CAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
333
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
863
XC3S1500-5FG676CXC3S1500-5FG676CAdvanced Micro DevicesIC FPGA 487 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
360
XC3S1500-5FGG320CXC3S1500-5FGG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
221
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
196
XC3S1500-5FGG456CXC3S1500-5FGG456CAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,499
XC3S1500-5FGG676CXC3S1500-5FGG676CAdvanced Micro DevicesIC FPGA 487 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
487
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
97
XC3S1500L-4FGG320CXC3S1500L-4FGG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
221
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
219
XC3S1500L-4FGG456CXC3S1500L-4FGG456CAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
658
XC3S1500L-4FGG676CXC3S1500L-4FGG676CAdvanced Micro DevicesIC FPGA 487 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
487
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
29952
Qualification:
N/A
Total RAM Bits:
589824
770

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