Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2S60F484C4NEP2S60F484C4NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,971
EP2S60F484C5EP2S60F484C5IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
359
EP2S60F484C5NEP2S60F484C5NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
24
EP2S60F484I4EP2S60F484I4IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,129
EP2S60F484I4NEP2S60F484I4NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,169
EP2S60F672C3EP2S60F672C3IntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
1,582
EP2S60F672C3NEP2S60F672C3NIntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
492
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
198
EP2S60F672C4EP2S60F672C4IntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
492
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
34
EP2S60F672C4NEP2S60F672C4NIntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
492
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
779
EP2S60F672C5EP2S60F672C5IntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
630
EP2S60F672C5NEP2S60F672C5NIntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
179
EP2S60F672I4EP2S60F672I4IntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
456
EP2S60F672I4NEP2S60F672I4NIntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
744
EP2S90F1020C3EP2S90F1020C3IntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Total RAM Bits:
4520488
Number of I/O:
758
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
424
EP2S90F1020C3NEP2S90F1020C3NIntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
758
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Qualification:
N/A
Total RAM Bits:
4520488
230
EP2S90F1020C4EP2S90F1020C4IntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Total RAM Bits:
4520488
Number of I/O:
758
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
455
EP2S90F1020C4NEP2S90F1020C4NIntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Total RAM Bits:
4520488
Number of I/O:
758
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
1,680
EP2S90F1020C5EP2S90F1020C5IntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
758
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Qualification:
N/A
Total RAM Bits:
4520488
189
EP2S90F1020C5NEP2S90F1020C5NIntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
758
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Qualification:
N/A
Total RAM Bits:
4520488
340
EP2S90F1020I4EP2S90F1020I4IntelIC FPGA 758 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
758
Number of LABs/CLBs:
4548
Number of Logic Elements/Cells:
90960
Qualification:
N/A
Total RAM Bits:
4520488
1,162

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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