Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
IS43DR86400E-3DBLIS43DR86400E-3DBLIntegrated Silicon Solution IncIC DRAM 512MBIT PAR 60TWBGAMemory60-TWBGA (8x10.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
104
IS43DR86400E-3DBL-TRIS43DR86400E-3DBL-TRIntegrated Silicon Solution IncIC DRAM 512MBIT PAR 60TWBGAMemory60-TWBGA (8x10.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
SSTL_18
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
120
IS43DR86400E-3DBLIIS43DR86400E-3DBLIIntegrated Silicon Solution IncIC DRAM 512MBIT PAR 60TWBGAMemory60-TWBGA (8x10.5)1.7V ~ 1.9V-40°C ~ 85°C (TA)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
582
IS43DR86400E-3DBLI-TRIS43DR86400E-3DBLI-TRIntegrated Silicon Solution IncIC DRAM 512MBIT PAR 60TWBGAMemory60-TWBGA (8x10.5)1.7V ~ 1.9V-40°C ~ 85°C (TA)
Access Time:
450 ps
Clock Frequency:
333 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
171
IS43LQ32K01S2A-046BLIN/AIS43LQ32K01S2A-046BLIIntegrated Silicon Solution IncIC DRAM 32G LVSTL 2.1GHZ TFBGAMemory200-TFBGA (10x14.5)0.57V ~ 0.65V, 1.06V ~ 1.17V, 1.70V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
LVSTL
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-TFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
473
IS43LQ32K01S2A-046BLI-TRN/AIS43LQ32K01S2A-046BLI-TRIntegrated Silicon Solution Inc32G, 1.06-1.17/1.70-1.95V, LPDDRMemory200-TFBGA (10x14.5)0.57V ~ 0.65V, 1.06V ~ 1.17V, 1.70V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
LVSTL
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-TFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
1,306
IS43LQ32K01S2A-053BLIN/AIS43LQ32K01S2A-053BLIIntegrated Silicon Solution Inc32G, 1.06-1.17/1.70-1.95V, LPDDRMemory200-TFBGA (10x14.5)0.57V ~ 0.65V, 1.06V ~ 1.17V, 1.70V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
1.866 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
LVSTL
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-TFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
306
IS43LQ32K01S2A-053BLI-TRN/AIS43LQ32K01S2A-053BLI-TRIntegrated Silicon Solution Inc32G, 1.06-1.17/1.70-1.95V, LPDDRMemory200-TFBGA (10x14.5)0.57V ~ 0.65V, 1.06V ~ 1.17V, 1.70V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
1.866 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
LVSTL
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-TFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
578
IS43R16160B-5TL-TRIS43R16160B-5TL-TRIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
900
IS43R16160B-5TLIIS43R16160B-5TLIIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,164
IS43R16160B-5TLI-TRIS43R16160B-5TLI-TRIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,607
IS43R16160B-6TL-TRIS43R16160B-6TL-TRIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,258
IS43R16160B-6TLIIS43R16160B-6TLIIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
623
IS43R16160B-6TLI-TRIS43R16160B-6TLI-TRIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
684
IS43R16160D-5BLIS43R16160D-5BLIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
109
IS43R16160D-5BLIIS43R16160D-5BLIIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
199
IS43R16160D-5TLIS43R16160D-5TLIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
665
IS43R16160D-5TL-TRIS43R16160D-5TL-TRIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,159
IS43R16160D-5TLIIS43R16160D-5TLIIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,216
IS43R16160D-6BLIS43R16160D-6BLIntegrated Silicon Solution IncIC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
761

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