Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC7K480T-L2FFG901EXC7K480T-L2FFG901EAdvanced Micro DevicesIC FPGA 380 I/O 901FCBGAFPGAs901-FCBGA (31x31)870 mV - 930 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
380
Number of LABs/CLBs:
37325
Number of Logic Elements/Cells:
477760
Qualification:
N/A
Total RAM Bits:
35205120
238
XC7K480T-L2FFG901IXC7K480T-L2FFG901IAdvanced Micro DevicesIC FPGA 380 I/O 901FCBGAFPGAs901-FCBGA (31x31)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
380
Number of LABs/CLBs:
37325
Number of Logic Elements/Cells:
477760
Qualification:
N/A
Total RAM Bits:
35205120
1,020
XC7K70T-1FB484IXC7K70T-1FB484IAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
285
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
737
XC7K70T-1FB676IXC7K70T-1FB676IAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
300
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
1,638
XC7K70T-1FBG484C
XC7K70T-1FBG484CAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
285
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
812
XC7K70T-1FBG484IXC7K70T-1FBG484IAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
285
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
81
XC7K70T-1FBG676CXC7K70T-1FBG676CAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)970 mV - 1.03 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
300
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
1,585
XC7K70T-1FBG676IXC7K70T-1FBG676IAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
300
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
1,243
XC7K70T-1FBV484CXC7K70T-1FBV484CAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)970 mV - 1.03 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
285
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
328
XC7K70T-2FB484I
XC7K70T-2FB484IAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.97V ~ 1.03V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
285
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
1,311
XC7K70T-2FBG484C
XC7K70T-2FBG484CAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
285
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
998
XC7K70T-2FBG484IXC7K70T-2FBG484IAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
285
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
389
XC7K70T-2FBG676C
XC7K70T-2FBG676CAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
300
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,564
XC7K70T-2FBG676IXC7K70T-2FBG676IAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
300
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
265
XC7K70T-3FBG484EXC7K70T-3FBG484EAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)970 mV - 1.03 V0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
285
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Qualification:
N/A
Total RAM Bits:
4976640
683
XC7K70T-3FBG676E
XC7K70T-3FBG676EAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.97V ~ 1.03V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
300
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,428
XC7K70T-L2FBG484E
XC7K70T-L2FBG484EAdvanced Micro DevicesIC FPGA 285 I/O 484FCBGAFPGAs484-FCBGA (23x23)0.97V ~ 1.03V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
285
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23×23)
1,527
XC7K70T-L2FBG676E
XC7K70T-L2FBG676EAdvanced Micro DevicesIC FPGA 300 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.97V ~ 1.03V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
5125
Number of Logic Elements/Cells:
65600
Total RAM Bits:
4976640
Number of I/O:
300
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,381
XC7S100-1FGGA484CXC7S100-1FGGA484CAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
338
Number of LABs/CLBs:
8000
Number of Logic Elements/Cells:
102400
Qualification:
N/A
Total RAM Bits:
4423680
519
XC7S100-1FGGA484IXC7S100-1FGGA484IAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
338
Number of LABs/CLBs:
8000
Number of Logic Elements/Cells:
102400
Qualification:
N/A
Total RAM Bits:
4423680
1,528

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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