Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/ALFXP10C-4FN388ILattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.71 V - 3.465 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
244
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
275
LFXP10C-5F256C
LFXP10C-5F256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.71V ~ 3.465V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
188
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
886
N/ALFXP10C-5F388CLattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.71 V - 3.465 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
244
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
732
N/A
LFXP10C-5FN388CLattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.71V ~ 3.465V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
244
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
118
LFXP10E-3FN256C
LFXP10E-3FN256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
188
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
121
LFXP10E-3FN256ILFXP10E-3FN256ILattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
188
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
1,119
N/A
LFXP10E-3FN388CLattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
244
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
838
N/A
LFXP10E-3FN388ILattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
244
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
506
LFXP10E-4FN256CLFXP10E-4FN256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
188
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
626
LFXP10E-4FN256I
LFXP10E-4FN256ILattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
188
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
423
N/A
LFXP10E-4FN388CLattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
244
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
269
N/A
LFXP10E-4FN388ILattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
10000
Total RAM Bits:
221184
Number of I/O:
244
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
1,105
LFXP10E-5FN256CLFXP10E-5FN256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
188
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
903
N/ALFXP10E-5FN388CLattice Semiconductor CorporationIC FPGA 244 I/O 388FBGAFPGAs388-FPBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
244
Number of LABs/CLBs:
1216
Number of Logic Elements/Cells:
10000
Qualification:
N/A
Total RAM Bits:
221184
1,174
LFXP15C-3F256C
LFXP15C-3F256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.71V ~ 3.465V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
15000
Total RAM Bits:
331776
Number of I/O:
188
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
632
LFXP15C-3F484CLFXP15C-3F484CLattice Semiconductor CorporationIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.71 V - 3.465 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
300
Number of LABs/CLBs:
1932
Number of Logic Elements/Cells:
15000
Qualification:
N/A
Total RAM Bits:
331776
733
LFXP15C-3F484I
LFXP15C-3F484ILattice Semiconductor CorporationIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.71V ~ 3.465V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
15000
Total RAM Bits:
331776
Number of I/O:
300
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FPBGA (23×23)
1,225
LFXP15C-3FN256CLFXP15C-3FN256CLattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.71 V - 3.465 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
188
Number of LABs/CLBs:
1932
Number of Logic Elements/Cells:
15000
Qualification:
N/A
Total RAM Bits:
331776
666
LFXP15C-3FN256I
LFXP15C-3FN256ILattice Semiconductor CorporationIC FPGA 188 I/O 256FBGAFPGAs256-FPBGA (17x17)1.71V ~ 3.465V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
15000
Total RAM Bits:
331776
Number of I/O:
188
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
1,523
N/A
LFXP15C-3FN388CLattice Semiconductor CorporationIC FPGA 268 I/O 388FBGAFPGAs388-FPBGA (23x23)1.71V ~ 3.465V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
15000
Total RAM Bits:
331776
Number of I/O:
268
Voltage – Supply:
1.71V ~ 3.465V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
388-BBGA
Supplier Device Package:
388-FPBGA (23×23)
412

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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