Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC6SLX75-N3FG676C
XC6SLX75-N3FG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,773
XC6SLX75-N3FG676IXC6SLX75-N3FG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
408
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
228
XC6SLX75-N3FGG484CXC6SLX75-N3FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,448
XC6SLX75-N3FGG484IXC6SLX75-N3FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
860
XC6SLX75-N3FGG676C
XC6SLX75-N3FGG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
952
XC6SLX75-N3FGG676I
XC6SLX75-N3FGG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
578
XC6SLX75T-2CSG484C
XC6SLX75T-2CSG484CAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
292
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
145
XC6SLX75T-2CSG484IXC6SLX75T-2CSG484IAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
292
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,293
XC6SLX75T-2FG484I
XC6SLX75T-2FG484IAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
268
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
548
XC6SLX75T-2FG676I
XC6SLX75T-2FG676IAdvanced Micro DevicesIC FPGA 348 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
348
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,312
XC6SLX75T-2FGG484CXC6SLX75T-2FGG484CAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
268
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,302
XC6SLX75T-2FGG484IXC6SLX75T-2FGG484IAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
268
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
132
XC6SLX75T-2FGG676CXC6SLX75T-2FGG676CAdvanced Micro DevicesIC FPGA 348 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
348
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
441
XC6SLX75T-2FGG676IXC6SLX75T-2FGG676IAdvanced Micro DevicesIC FPGA 348 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
348
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
510
XC6SLX75T-3CSG484CXC6SLX75T-3CSG484CAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
292
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
309
XC6SLX75T-3CSG484I
XC6SLX75T-3CSG484IAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
292
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
1,112
XC6SLX75T-3FG484I
XC6SLX75T-3FG484IAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
268
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
147
XC6SLX75T-3FG676IXC6SLX75T-3FG676IAdvanced Micro DevicesIC FPGA 348 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
348
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
847
XC6SLX75T-3FGG484C
XC6SLX75T-3FGG484CAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
268
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,488
XC6SLX75T-3FGG484IXC6SLX75T-3FGG484IAdvanced Micro DevicesIC FPGA 268 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
268
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,254

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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